Sony Ericsson 802se Скачать руководство пользователя страница 6

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Working Instruction

Electrical

2.1.1 Reflow

Profiles

Sn/Ag/Cu (Lead free)

Preheat zone

Reflow zone

100

260°C
245°C
235°C

Cooling zone

290

250

200

150

Tempe

ratu

re [ºC]

80 120

160 200

240 280

Time [Seconds]

Ramp rate

< 4°C/sec

Ramp rate cooling zone

< 6°C/sec

Time above liquids

60-150 sec

Minimum temperature

235°C

Maximum temperature

245°C or 260°C* for 10 sec

Total time

Appr. 4-7 min

* The higher temperature in case the board has extremely high

∆

3/000 21-2/FEA 209544/88 C
Company Internal



Sony Ericsson Mobile Communications AB

6(13)

Содержание 802se

Страница 1: ...MENT 7 3 2 INSTRUCTION HOW REPLACING PARTS 7 3 2 1 External Antenna Connector 8 3 2 2 30 PIN BTB Female Connector behind the System Connector 8 3 2 3 30 PIN BTB Female Connector 9 3 2 4 50 PIN BTB Female Connector 9 3 2 5 Battery Connector 10 3 2 6 USB Connector 10 3 2 7 MS Duo and SIM Reader 11 3 2 8 Hall Element 11 3 2 9 IrDa Module 12 3 2 10 Coax Connector 12 4 REVISION HISTORY 13 3 000 21 2 FE...

Страница 2: ...ant that all contact surfaces are kept clean from dirt and hand grease During electrical repair it is critical to make sure that no lead is introduced 1 1 1 Environment The introduction of the environment is as follow Information text 1 This symbol indicates that the product is lead free 2 All lead free PCB will be marked with this symbol according to the arrow 3 000 21 2 FEA 209544 88 C Company I...

Страница 3: ...ally 220 C Low wet ability High surface tension Difficult to spread Recommended tip temperature 370 C When servicing PCB s that is produced with Lead Free Solder paste this paste must be used Otherwise there is a high risk for unreliable soldering joints A smaller introduction of the solder temperature with pictures is as follow Information text 1 Lead Free Solder joints are more difficult to insp...

Страница 4: ...picture shows an example of solder joints with lead 3 The picture shows an example of lead free solder joints 4 The picture shows an example of solder joints with lead 3 000 21 2 FEA 209544 88 C Company Internal Sony Ericsson Mobile Communications AB 4 13 ...

Страница 5: ...rmal mass They shall be located in the beginning in the middle and at the end of the board panel They are recommended to be soldered on the board but glue and capton tape could also be used if necessary At least one probe shall be placed in the air or on top of a component These values are strongly depending on the BGA replacement equipment Nozzle type will be chosen after the outer size of the ac...

Страница 6: ...ºC 40 80 120 160 200 240 280 Time Seconds Ramp rate 4 C sec Ramp rate cooling zone 6 C sec Time above liquids 60 150 sec Minimum temperature 235 C Maximum temperature 245 C or 260 C for 10 sec Total time Appr 4 7 min The higher temperature in case the board has extremely high T 3 000 21 2 FEA 209544 88 C Company Internal Sony Ericsson Mobile Communications AB 6 13 ...

Страница 7: ...t air soldering station BGA replacement equipment Pair of tweezers Solder cleaning wiper Tin wick Solder paste Lead free SN 96 Ag 3 5 Cu 0 5 Use the soldering tip only for lead free solder paste Flux RMA No clean flux Cutting pliers Shield fence pliers NTZ 112 537 3 2 Instruction how replacing parts Before it is possible to replace any of these parts the phone has to be dissembled as described in ...

Страница 8: ...or Step by Step Instructions 1 NOTE The 30 PIN BTB Female Connector is located behind the System Connector according to the arrow 1 Remove the System Connector NOTE The Light Gasket is located according to the arrow 2 Be careful not to damage other components Use a dentist hook to remove the Light Gasket Clean the surface with Isopropyl alcohol Use BGA Repair Equipment to replace the Antenna 30 PI...

Страница 9: ...e right position according to the arrow 2 Apply a new Sealing Gasket 1 2 3 2 4 50 PIN BTB Female Connector This is the instruction how to replace the 50 PIN BTB Female Connector Step by Step Instructions 1 NOTE The Sealing Gasket is located according to the arrow 1 Be careful not to damage other components Usa a dentist hook to remove the Sealing Gasket Clean the surface with Isopropyl alcohol Use...

Страница 10: ...rding to the arrow Use BGA Repair Equipment to remove and assemble a new Battery Connector 3 2 6 USB Connector This is the instruction how to replace the USB Connector Step by Step Instructions 1 NOTE The USB Connector is located according to the arrow Use a soldering iron to replace USB Connector 3 000 21 2 FEA 209544 88 C Company Internal Sony Ericsson Mobile Communications AB 10 13 ...

Страница 11: ...is located according to the arrow Use a soldering iron replace the MS Duo and SIM Reader 3 2 8 Hall Element This is the instruction how to replace the Hall element Step by Step Instructions 1 NOTE The Hall Element is located according to the arrow Use a soldering iron to replace the Hall Element 3 000 21 2 FEA 209544 88 C Company Internal Sony Ericsson Mobile Communications AB 11 13 ...

Страница 12: ...located according to the arrow Use a soldering iron to replace the IrDa Module 3 2 10 Coax Connector This is the instruction how to replace the Coax Connector 1 NOTE The Coax Connector is located according to the arrow Use a soldering iron to replace the Coax Connector 3 000 21 2 FEA 209544 88 C Company Internal Sony Ericsson Mobile Communications AB 12 13 ...

Страница 13: ...8 C Company Internal Sony Ericsson Mobile Communications AB 13 13 4 Revision History The list over the revision history is as follows Rev Date Changes Comments A 2004 11 17 First Release B 2004 12 13 Due to system problem C 2004 12 15 Due to system problem ...

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