Working Instruction
,
Electrical
2 BGA Equipment reflow profiles
This chapter contains recommendations for reflow profile for mobile phones and similar
products. This is only general recommendation and considerations have to be taken for every
single product. The solder paste is secondary but could also affect the parameters.
In this document one alloy is specified:
SnAgCu (Lead free) melting point 217°C
2.1 Temperature
measurement
At least 4 probes should be used:
They should be placed on components with the highest and lowest thermal mass.
They shall be located in the beginning, in the middle and at the end of the board/panel.
They are recommended to be soldered on the board but glue and capton tape could also be
used if necessary.
At least one probe shall be placed in the air or on top of a component.
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle
does not affect any near placed components.
NOTE:
These values are recommendations and may have to be changed depending on the type of
equipment.
The maximum temperature for any component must not exceed 250C.
3/000 21-2/FEA 209544/88 C
Company Internal
Sony Ericsson Mobile Communications AB
5(13)
