SHANGHAI SIMCOM LIMITED
31
5 Mechanical Specification
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5.1 Overview
This specification defines a small form factor module for systems in which a Stamp hole package
add-in module can not be used due to mechanical system design constraints. The specification
defines a smaller module based on a single 124-pin Leadless Chip Carriers encapsulation for
system interfaces by card edge type. The specification also defines the Stamp hole package system.
5.2 SIMT1502 specifications
There is Stamp hole package add-in SIMT1502 size.
For purposes of the drawings in this specification, the following notes apply:
All dimensions are in millimeters, unless otherwise specified.
All dimensions tolerances are ± 0.15 mm, unless otherwise specified.
Dimensions marked with an asterisk (
*
) are overall envelope dimensions and include space
allowances for insulation to comply with regulatory and safety requirements.
Insulating material shall not interfere with or obstruct mounting holes or grounding pads.
5.2.1 SIMT1502 from factor
The SIMT1502 form factor is specified by
Figure5-1
.
The figure illustrates a module example application. The hatched area shown in this figure
represents the available component volume for the SIMT1502’s circuitry.
Figure5-1 SIMT1502 form factor
Содержание SIMT 1502
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