SimCom SIM808, Проектирование аппаратного обеспечения

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SIM808_Hardware Design_V1.00 2014.03.27 62
7.3 The Moisture Sensitivity Level
The moisture sensitivity level of SIM808 is 3. The module should be mounted within 168 hours after unpacking
in the environmental conditions of temperature <30°C and relative humidity of <60% (RH). It is necessary to
bake the module if the above conditions are not met:
Table 51 : Moisture classification level and floor life
Level Floor Life (out of bag) at factory ambient ≤ 30 °C /60% RH or as stated
1 Unlimited at ≤ 30°C /85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the
label.
NOTES:
1. If the vacuum package is not open for 6 months or longer than the packing date, baking is also recommended before re-flow
soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4 Baking Requirements
Because of its sensitivity to moisture absorption, SIM808 should be baked sufficiently before re-flow soldering.
Otherwise SIM808 will be at the risk of permanent damage during re-flow soldering. SIM808 should be baked
192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device containers, or 72 hours at
temperature 80°C±5°C for high-temperature device containers. Care should be taken that the plastic tray is not
heat resistant, SIM808 modules should be taken out for baking, and otherwise the tray may be damaged by
high-temperature during baking.
Table 52 : Baking requirements
Baking temperature Moisture Time
40°C±5°C <5% 192 hours
120°C±5°C <5% 4 hours