4114877
Rev 5.0
October 12, 2015
22
Development Kit User Guide
General Description
Test
Port #
Test Port
Serigraphy
Board to Board
Connector Pin #
HL6528x Signal
Name
HL75xx Signal
Name
HL85xxx Signal
Name
64
SIM1 CLK
CN201.49
UIM1_CLK
UIM1_CLK
UIM1_CLK
1
Not available on the HL7518 and HL7548.
2
Not available on the HL7528 and HL7549.
3
Only available on the HL7528 and HL7549.
4
Not available on the HL7518, HL7519, HL7548 and HL7588.
5
Only available on the HL7528, HL7549 and HL7588.
6
Not available on the HL8518, HL8528 and HL8529.
7
Not available on the HL7518.
2.3.
Special Solder for Jumper Solder Pads
Jumper solder pads are used for interfaces and peripherals that can be disconnected electrically.
To connect signals between the embedded module and the dedicated connector on the HL Series
Development Kit, solder these jumper pads.
Figure 8.
Jumper Solder Pad
Interfaces and peripherals that may be electrically disconnected via jumper solder pads include:
Module Detection Circuit (from TP502 to TP507)
PWM1 (from TP800 to TP801)
PWM2 (from TP802 to TP803)
VBATT_RF bypass U400 chipset (TP405)
Note:
All jumper solders are
not soldered
in the initial development kit configuration.
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