
Private Communication Systems
Mobile Phones
6. Lift off assembly of MMI-Board (1010) and RF-/Control Module (1000).
7. Level-2 repairs only:
a) Desolder RF-Cable (1150) from RF-/Control Module (1000).
b) Remove fixing spring (1100) from shielding cover (1060).
c) Remove RF-/Control Module (1000) along with upper and lower shielding
covers (1060+1050) from MMI-Board (1010).
e) Remove clamps (1210)
d) Separate shielding covers from RF-/Control Module and remove battery
contacts (1140).
e) Remove fixing pin (1090) from MMI-Board (1010).
f) Remove ringer gasket (1170) from MMI-Board (1010).
8. Remove dust protection frame (1190) from upper case (1030).
9. Lift off keypad (1020) and earphone capsule (1120) from upper case (1030).
10. Remove microphone (1110) and microphone gasket (1220).
3.3Assembling the S11
ESD regulations have to be followed!
1. Insert microphone (1110), microphone gasket (1220) and earphone capsule
(1120) into upper case shell (1030).
2. Insert keypad (1020) into upper case shell (1030).
3. Put dust protection frame (1190) on display window inside upper case shell.
4. Put assembly of MMI-Board (1010) and RF-/Control Module (1000) into upper
case shell.
Before that:
(only for level-2 repairs)
V1.1
7
PN MP ST
D. Schnoor
04/98