Sharp LC-32LE340E, Руководство по обслуживанию

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LC-32LE340/343
LC-40LE340/343
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7. FPGA (Spartan-3E)
XC3S1200E
a) General Description
The Spartan™-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically
designed to meet the needs of high volume, cost-sensitive consumer electronic applications.
The five-member family offers densities ranging from 100,000 to 1.6 million system gates,
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7. FPGA (Spartan-3E)
XC3S1200E
a) General Description
The Spartan™-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically
designed to meet the needs of high volume, cost-sensitive consumer electronic applications.
The five-member family offers densities ranging from 100,000 to 1.6 million system gates,
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The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the
amount of logic per I/O, significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of configuration. These Spartan-3E
enhancements, combined with advanced 90 nm process technology, deliver more
functionality and bandwidth per dollar than was previously possible, setting new standards in
the programmable logic industry. Because of their exceptionally low cost, Spartan-3E FPGAs
are ideally suited to a wide range of consumer electronics applications, including broadband
access, home networking, display/projection, and digital television equipment. The Spartan-
3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial
cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs.
Also, FPGA programmability permits design upgrades in the field with no hardware
replacement necessary, an impossibility with ASICs.
b) Features
• Very low cost, high-performance logic solution for high-volume, consumer-oriented
applications
• Proven advanced 90-nanometer process technology
• Multi-voltage, multi-standard SelectIO™ interface pins
- Up to 376 I/O pins or 156 differential signal pairs
- LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
- 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
- 622+ Mb/s data transfer rate per I/O
- True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
- Enhanced Double Data Rate (DDR) support
- DDR SDRAM support up to 333 Mb/s
• Abundant, flexible logic resources
- Densities up to 33,192 logic cells, including optional shift register or distributed
RAM support
- Efficient wide multiplexers, wide logic
- Fast look-ahead carry logic
- Enhanced 18 x 18 multipliers with optional pipeline
- IEEE 1149.1/1532 JTAG programming/debug port
• Hierarchical SelectRAM™ memory architecture
- Up to 648 Kbits of fast block RAM
- Up to 231 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
- Clock skew elimination (delay locked loop)
- Frequency synthesis, multiplication, division
- High-resolution phase shifting
- Wide frequency range (5 MHz to over 300 MHz)
• Eight global clocks plus eight additional clocks per each half of device, plus abundant low-
skew routing
• Configuration interface to industry-standard PROMs
- Low-cost, space-saving SPI serial Flash PROM
- x8 or x8/x16 parallel NOR Flash PROM
- Low-cost Xilinx Platform Flash with JTAG
• Complete Xilinx ISE™ and WebPACK™ development system support
• MicroBlaze™ and PicoBlaze™ embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI support
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LC-32LE340/343
LC-40LE340/343