RELEASE
Revision B1
©Serious Integrated, Inc.
19
DAUGHTER CARD PHYSICAL GUIDELINES
This section is provided as a helpful overview only.
The authoritative mechanical reference is the SIM535 Mechanical Design Package (MDP), which includes 2D drawings and
STEP models, and is available for download at
www.seriousintegrated.com/docs
.
Most SIM535 variants include the
60-Pin Board-to-Board Expansion Connector
. These variants also include six M3
threaded standoffs (
PennEngineering® SMTSO-M3-4-ET
or similar) to firmly support and attach a daughter card at the
correct 4mm board-to-board distance.
Serious
reserves the right to substitute components and/or change component layout on SIMs at any time without notice.
Exceeding the height envelope described below with the assumption of specific SIM component used and/or placement so as
to utilize the inner-stack-height for daughter card components may cause mechanical conflicts in future SIM revisions.
It is possible to create a single daughter card that can dock into numerous SIMs, including the SIM115, SIM231, and SIM535.
Consult the respective Technical Reference Manuals (TRMs) to validate a compatible footprint: there are slight differences in
the physical and electrical characteristic for daughter cards across different SIMs.
The board-to-board distance with this connector (when used with an identical mated connector) is only 4mm, enabling a
daughter card to be developed with a very low overall combined profile. For components on the side of the daughter
card facing the SIM, observe the maximum component height zones on the SIM – your components may extend only
4mm
less this distance
on the SIM-facing side of your PCB:
Example SIM535-A01-R22ALL Max Height Zone Map
For example, in the yellow shaded area above, the components on the SIM535 are less than 2mm total height, leaving
(4mm board-to board) minus (2mm yellow height zone) = 2mm for components on the SIM-facing side of a daughter
card.
Note that component data sheets typically indicate the physical height of the component which is not necessarily the same as
the total height of the component after soldering, which may slightly raise (or even lower, in the case of some BGAs) the
component.
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