Seagate SkyHawk Product Manual, Rev. A
17
Drive Specifications
2.13
Environmental Protection
Seagate designs its products to meet environmental protection requirements worldwide, including regulations restricting certain chemical
substances.
2.13.1
European Union Restriction of Hazardous Substances (RoHS) Directive
The European Union Restriction of Hazardous Substances (RoHS) Directive, restricts the presence of chemical substances, including Lead, Cadmium,
Mercury, Hexavalent Chromium, PBB and PBDE, in electronic products, effective July 2006. This drive is manufactured with components and
materials that comply with the RoHS Directive.
2.13.2 China Requirements — China RoHS 2
China RoHS 2 refers to the Ministry of Industry and Information Technology Order No. 32, effective July 1, 2016, titled Management
Methods for the Restriction of the Use of Hazardous Substances in Electrical and Electronic Products. To comply with China RoHS 2,
we determined this product's Environmental Protection Use Period (EPUP) to be 20 years in accordance with the
Marking for the
Restricted Use of Hazardous Substances in Electronic and Electrical Products,
SJT 11364-2014.
中国电器电子产品有害物质限制使用管理办法
(Management Methods for the Restriction of the Use of Hazardous Substances in Electrical and Electronic
Products _ China RoHS)
产品中有害物质的名称及含量
(Name and Content of the Hazardous Substances in Product)
2.14
Corrosive Environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light industrial environments
containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845. However, this accelerated testing cannot duplicate every
potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive
component reliability can be affected by the installation environment. The silver, copper, nickel and gold films used in Seagate products are
especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic
components should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or exposed to an ambient
relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should
be minimized or eliminated. The useful life of any electronic equipment may be extended by replacing materials near circuitry with sulfide-free
alternatives.
Table 10 Hazardous Substances
部件名称
Part Name
有害物
质
Hazardous Substances
铅
Lead
(Pb)
汞
Mercury
(Hg)
镉
Cadmium
(Cd)
六价
铬
Hexavalent Chromium
(CF (VI))
多溴
联
苯
Polybrominated
biphenyls (PBB)
多溴二苯
醚
Polybrominated
diphenyl ethers (PBDE)
印刷
电路板组
装
PCBA
X
O
O
O
O
O
机壳
Chassis
X
O
O
O
O
O
本表格依据
SJ/T 11364
的规定编制。
This table is prepared in accordance with the provisions of SJ/T 11364-2014
O
：表示该有害物质在该部件所有均质材料中的含量均在
GB/T 26572
规定的限量要求以下。
O:
Indicates that the hazardous substance contained in all of the homogeneous materials for this part is below the limit
requirement
of
GB/T26572.
X
：表示该有害物质至少在该部件的某一均质材料中的含量超出
GB/T 26572
规定的限量要求。
X:
Indicates that the hazardous substance contained in at least one of the homogeneous materials used for this part is above the
limit
requirement
of
GB/T26572.
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