Computerized
Analysis & Simulation Ltd.
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Ref: w06e048d.doc
CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL
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1
Scope
The document summarized thermal analysis for the "Flash Disc module", based on the
customer design data.
It includes the base design data, description of the thermal model, the solution process
and graphical and numerical representation of the results (temperature distribution and
components case and junction temperatures).
2
Applicable Documents
1.
J. P. Holman ,Heat Transfer, McGraw Hill, 1989.
2.
D. S. Steinberg, Cooling Techniques for Electronic Equipment, Wily Inter
Science, 1980.
3.
Kraus A. D. and Bar-Cohen A., Thermal Analysis and Control of
Electronic Equipment, McGraw Hill, 1983.
4.
Coolit user manual, DAAT Crop., 2005.
3
The Flash Disk Description
3.1
The Flash Disk description
The Flash disk module is built from a plastic structure. At the 2 side mounted 2
PCBs : the Memory PCB and the CPU PCB.
The structure is covered by two stainless steel covers connected by 4 screws.
The "sandwich" structure contains thermal pad between the 2 PCBs and between
the Memory PCB and the cover.
