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Abstract
The document summarizes thermal analysis for the mSSD UATA 5000 1.8” CG with
ZIF connector - "Flash Disk Module"
The main aim is to check whether the current design meets thermal design requirements.
The analysis results are temperatures distribution figures and components case and
junction temperatures.
The analysis results shows that all the components checked, are below the maximum
allowable temperatures based on the thermal demand T
well
=70
o
C