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Revision 3.1 

 

SanDisk iNAND Product Manual 

© 2006 SanDisk Corporation 

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TABLE OF CONTENTS 

 

1. Introduction ...................................................................................................1-1 

1.1  General Description ................................................................................1-1 
1.2  Features...................................................................................................1-2 
1.3  Document Scope.....................................................................................1-2 
1.4  iNAND Standard ....................................................................................1-2 
1.5  Functional Description............................................................................1-3 
1.6  Technology Independence ......................................................................1-3 
1.7  Defect and Error Management................................................................1-4 
1.8  Wear Leveling.........................................................................................1-4 
1.9  Automatic Sleep Mode ...........................................................................1-4 
1.10 iNAND—SD Bus Mode ........................................................................1-4 
1.11 SPI Mode ...............................................................................................1-6 
 

2. Product Specifications...................................................................................2-1 

2.1  Overview ................................................................................................2-1 
2.2  Typical Card Power Requirements .........................................................2-1 
2.3  System Performance ...............................................................................2-1 
2.4  System Reliability and Maintenance ......................................................2-1 
2.5  Physical Specifications ...........................................................................2-2 
2.6  Capacity Specifications ..........................................................................2-4 
 

3. iNAND Interface Description .......................................................................3-1 

3.1  Pins and Registers...................................................................................3-1 
3.2  Bus Topologies .......................................................................................3-2 
3.3  Electrical Interface..................................................................................3-3 
3.4  iNAND Registers....................................................................................3-3 
3.5  Data Interchange Format and Card Sizes ...............................................3-3 
 

4. iNAND Protocol Description ........................................................................4-1 

4.1  General ...................................................................................................4-1 
4.2  SD Bus Protocol .....................................................................................4-1 
4.3  Functional Description............................................................................4-1 
 
Appendix A  Capacitor Specifications .......................................................... A-1 
Appendix B  Ordering Information .............................................................. B-1 
Appendix C  SanDisk Worldwide Sales Offices........................................... C-1 
Appendix D  Limited Warranty .................................................................... D-1 
Appendix E  Disclaimer of Liability............................................................. E-1 

Содержание INAND

Страница 1: ...isk Product Manual Version 3 1 Document No 80 36 00450 December 2006 SanDisk Corporation Corporate Headquarters 601 McCarthy Boulevard Milpitas CA 95035 Phone 408 801 1000 Fax 408 801 8657 www sandisk...

Страница 2: ...d all rights are reserved SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation CompactFlash is a U S registered trademark of SanDisk Corporation Product names mentioned herein...

Страница 3: ...cal Card Power Requirements 2 1 2 3 System Performance 2 1 2 4 System Reliability and Maintenance 2 1 2 5 Physical Specifications 2 2 2 6 Capacity Specifications 2 4 3 iNAND Interface Description 3 1...

Страница 4: ...SD interface product is fully compatible with iNAND products and provides a 4 bit data bus for maximum performance For compatibility with existing controllers the iNAND offers in addition to these in...

Страница 5: ...across all capacities 1 3 Document Scope This document describes the key features and specifications of the SanDisk iNAND as well as the information required to interface it to a host system Chapter...

Страница 6: ...yte sector size of the SanDisk iNAND is the same as that in an IDE magnetic disk drive To write or read a sector or multiple sectors the host software simply issues a read or write command to the card...

Страница 7: ...sleep mode Upon completion of an operation cards enter sleep mode to conserve power if no further commands are received in less than 5 milliseconds ms The host does not have to take any action for th...

Страница 8: ...e 1 2 Memory Array Partitioning Figure 1 3 Data Transfer Formats Multiple Block Mode Memory Sectors Memory Sectors Memory Sectors Memory Sectors Memory Sectors Memory Sectors Memory Sectors Memory Sec...

Страница 9: ...aligned to a sector boundary Multiple Block This mode is similar to the single block mode except for the host can read write multiple data blocks all have the same length that are stored or retrieved...

Страница 10: ...lue Measurement Average Sleep 250 uA Max Read 100 mA Max Write 100 mA Max 2 3 System Performance All performance values for iNAND in Table 2 2 were measured using the following conditions Voltage rang...

Страница 11: ...2 2 12 07 06 2 5 Physical Specifications The SanDisk iNAND is a 56 pin thin fine pitched ball grid array BGA See Figure 2 1 56 pin for physical specifications and dimensions See Figure 2 2 for a top...

Страница 12: ...713 E 11 90 12 00 12 10 0 469 0 472 0 476 D1 7 00 0 276 D2 11 00 0 433 D3 13 00 0 512 E1 7 00 0 276 e 1 00 0 039 b 0 45 0 50 0 55 0 018 0 020 0 022 aaa 0 10 0 004 bbb 0 10 0 004 ddd 0 15 0 006 eee 0...

Страница 13: ...fications Table 2 5 Model Capacity Summary Model No Capacity SDINB1 256 256 MB SDINB1 512 512 MB SDINB1 1024 1024 MB SDINB1 2048 2048 MB SDINB1 4096 4096 MB 1 megabyte MB 1 million bytes 1 gigabyte GB...

Страница 14: ...Line Bit 2 G5 DAT3 I O Data Line Bit 3 G1 CLK I Clock G4 CMD I O Command Response B5 WPB I Defines I F Connect to VDD G7 RSTB I Defines I F Connect to VDD B2 RDY BSY NC B3 SEL_A I Defines I F Connect...

Страница 15: ...iNAND Register Overview Register Abbreviation Width in bits Register Name CID 128 Card Identification Number RCA 16 Relative Card Address CSD 128 Card Specific Data SCR 64 SD Configuration OCR 32 Oper...

Страница 16: ...Timing Default See Section 6 7 of the SDA Physical Layer Specification Version 2 00 3 3 4 Bus Timing High Speed Mode See Section 6 8 of the SDA Physical Layer Specification Version 2 00 3 4 iNAND Regi...

Страница 17: ...56 Five ASCII characters long Product Revision PRV BCD 8 Product Revision xx See Section 5 2 in the SDA Physical Layer Specification Version 2 00 Serial Number PSN Binary 32 Product Serial Number 32 b...

Страница 18: ...ion Card Capacity Version 1 01 to 1 10 0 CSD Version 1 0 Version 2 00 Standard Capacity 1 CSD Version 2 0 Version 2 00 High Capacity 2 3 Reserved Table 3 5 provides an overview of the CSD Register Mor...

Страница 19: ...sector size WP_GRP_ SIZE 128 sectors Write protect group size WP_GRP_ ENABLE Yes Write protect group enable Reserved Reserved for MMC compatibility R2W_ FACTOR x16 Write speed factor WRITE_BL_ LEN 2G...

Страница 20: ...D_BL_ LEN Max read data block length READ_BL_ PARTIAL Yes Partial blocks for read allowed WRITE_BLK_ MISALIGN No Write block misalignment READ_BLK_ MISALIGN No Read block misalignment DSR_IMP No DSR i...

Страница 21: ...Card Address RCA Register carries the card address published by the card during the card identification Refer to Section 5 4 in the SDA Physical Layer Specification Version 2 00 for more information 3...

Страница 22: ...ctors User Data Bytes 4 GB 8 027 136 8192 8 018 944 8 012 708 4 102 506 496 2 GB 4 013 056 523 4 011 595 4 011 072 2 053 668 864 1 GB 2 006 528 523 2 005 675 2 005 152 1 026 637 824 512 MB 1 003 264 2...

Страница 23: ...ings are also provided For detailed information refer to Section 4 of the SDA Physical Layer Specification Version 2 00 4 3 1 Card Identification Mode In Card Identification Mode the host resets all c...

Страница 24: ...Version 2 00 for detailed information about iNAND commands 4 3 7 Card State Transition The state transition is dependent on the received command The transition is defined in Section 4 8 of the SDA Phy...

Страница 25: ...tructions are detailed below The trace requirements from the FCAP G8 pin to the capacitor are as follows Resistance 2 ohm Inductance 5 nH The capacitor requirements are as follows Capacitance 2 2uF Vo...

Страница 26: ...rder SanDisk products directly from SanDisk call 408 801 1000 Part Number Block Size 1 SDINB1 256 256 MB SDINB1 512 512 MB SDINB1 1024 1024 MB SDINB1 2048 2048 MB SDINB1 4096 4096 MB 1 1 megabyte MB 1...

Страница 27: ...el 408 801 1000 Fax 408 801 8657 Northeastern USA Canada 620 Herndon Pkwy Suite 200 Herndon VA 22070 Tel 703 481 9828 Fax 703 437 9215 International OEM Sales Offices Europe SanDisk GmbH Karlsruher St...

Страница 28: ...CESS OF THE PURCHASE PRICE OF THE PRODUCT ARISING OUT OF THE USE OR INABILITY TO USE SUCH PRODUCT TO THE FULL EXTENT SUCH MAY BE DISCLAIMED BY LAW SanDisk s products are not warranted to operate witho...

Страница 29: ...erves the right to market any products whether new repaired or rebuilt under different specifications and product designations if such products do not meet the original product s specifications IV REC...

Страница 30: ...systems or other applications where failure could cause damage injury or loss of life the products should only be incorporated in systems designed with appropriate redundancy fault tolerant or back up...

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