SAMSUNG Proprietary-Contents may change without notice
2-3
STH-A225 Electrical Parts List
2
2203-005061
C174
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C175
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005065
C176
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000278
C177
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000233
C178
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C179
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000679
C180
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005065
C181
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000233
C201
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C202
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C203
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C204
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C205
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C206
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C207
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C208
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C209
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C210
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005061
C211
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C218
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C219
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001088
C220
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001105
C221
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C222
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005065
C223
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005065
C224
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000940
C225
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
2
2404-001105
C226
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001088
C227
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001088
C228
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001105
C229
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C230
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000438
C231
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C232
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
Содержание STH-A225
Страница 2: ... Samsung Electronics Co Ltd December 2001 Pinted in Korea Code No GH68 01930A BASIC ELECTRONICS ...
Страница 35: ...SAMSUNG Proprietary Contents may change without notice 4 2 STH A225 Block diagrams 2 Radio Part Block Diagram ...
Страница 36: ...SAMSUNG Proprietary Contents may change without notice 4 3 STH A225 Block diagrams MEMO ...