3-2
Samsung Electronics
Disassembly & Reassembly
No.
Description
Description Photo
2
1) Separate 3 cables (FFC Cable) from MAIN PCB.
2) Separate 2 Speaker Wires from MAIN PCB.
3) Separate the connection between MAIN PCB & SMPS
PCB.
4) Remove 5 screws.
3
1) Remove the screw and separate the Wireless Module.
2) Separate the chassis from the front cover.
3) Separate the VFD Assy.
MAIN PCB
SMPS PCB
Содержание HW-C450
Страница 15: ...Samsung Electronics 3 3 Disassembly Reassembly No Description Description Photo 4 1 Separate Speaker L R ...
Страница 16: ...3 4 Samsung Electronics MEMO ...
Страница 35: ...Samsung Electronics 4 19 MEMO ...
Страница 50: ...6 2 Samsung Electronics PCB Diagram 6 2 VFD PCB Top CN1 ...
Страница 51: ...Samsung Electronics 6 3 PCB Diagram 6 3 VFD PCB Bottom ...
Страница 52: ...6 4 Samsung Electronics PCB Diagram 6 4 KEY PCB Top ...
Страница 53: ...Samsung Electronics 6 5 PCB Diagram 6 5 KEY PCB Bottom IC1 ...
Страница 56: ...6 8 Samsung Electronics PCB Diagram TP1 TP2 6 6 2 Test Point Wave Form TP4 TP6 TP7 TP8 TP9 TP10 ...
Страница 57: ...Samsung Electronics 6 9 PCB Diagram 6 7 MAIN PCB Bottom TP3 TP5 DIIC1 DSIC3 PWIC1 IC1 ...
Страница 58: ...6 10 Samsung Electronics PCB Diagram 6 7 1 Test Point Wave Form TP3 TP5 ...
Страница 59: ...Samsung Electronics 6 11 PCB Diagram 6 8 SMPS PCB Top 1 CN2 CN1 ...
Страница 61: ...Samsung Electronics 6 13 PCB Diagram 6 9 SMPS PCB Bottom ...
Страница 62: ...6 14 Samsung Electronics MEMO ...
Страница 72: ...7 10 Samsung Electronics MEMO ...