Proc sheet 1 10
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1/1
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-Tweezers
- Cross shaped screw
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1. Remove the battery (Proc sheet 0 01).
2. Remove the lower housing of mobile (Proc sheet 1 01).
3. Remove the keyboard (Proc sheet 1 04))
4. Remove MMI board (Proc sheet 1 07).
5. Remove the flap (Proc sheet 1 09).
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1. Remove the 4 mask screw (1,2).
2. Fall and remove the 4 screw (3).
3. Open the flap beginning by the hinge (4).
4. lower housing flap (5) et upper housing (6)
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1. Lock the lower housing and upper flap housing together(5,6).
2. Position and screw (torque of 0.07 N.m) the 4 flap screw fixing (3).
3. Position the 4 mask screw (1,2).
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1. Place the flap (Proc sheet 1 09)
2. Place the keyboard ( Proc sheet 1 04).
3. Place the board MMI (Proc sheet 1 07).
4. Place the lower housing of mobile (Proc sheet 1 01).
5. Place of the battery (Proc sheet 0 01)
Risk of the procedude:
Damage the FPC
Damage plastic component
Procedure
Symptom
Test
REF MTB DTS 8- Indice B - February 21 2006
Page 5-17
Содержание Sagem Communication myC2-3
Страница 2: ...Site technical documentation myC2 3 Contents REF MTB DTS 8 Indice B February 21 2006 Page 2...
Страница 31: ...Site technical documentation myC2 3 SYMPTOM SHEETS Contents REF MTB DTS 8 Indice B February 21 2006 Page 3 9...
Страница 43: ...Site technical documentation myC2 3 TEST SHEETS Contents REF MTB DTS 8 Indice B February 21 2006 Page 4 3...
Страница 91: ...Site technical documentation myC2 3 Contents REF MTB DTS 8 Indice B February 21 2006 Page 8 3...
Страница 92: ...Site technical documentation myC2 3 APPENDIX Contents REF MTB DTS 8 Indication B February 21 2006...