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User’s Guide
HB2637L-EVK-301
© 2022 ROHM Co., Ltd.
No. 65UG002E Rev.001
Apr. 2022
4. Starting Up the Board and Tests
The below procedures must be followed before beginning with the tests.
1. Mounting spacers and screws have been provided in a separate packet along with the board. Before starting any kind of
tests, these spacers must be mounted.
2. Solder pin headers on all the necessary test points of the signals that are to be measured.
3. If the device current is to be measured with a Rogowski coil, ensure that jumper J1 is shorted and if co-axial shunt is
used then it must be soldered on to J1.
4. Decide if a 0V turn off or negative gate turn off is necessary and then place the jumpers J2, J3, J4 and J5 accordingly.
Do not leave the jumpers J2 and J4 open.
5. Decide if a simple double pulse measurement is to be performed or if a measurement in continuous power operation has
to be performed. For double pulse tests heatsink need not be mounted, but for continuous operation heatsink might be
needed
6. Supply 15-18V at the connector CO1 and check for correct polarity.
7. Three LEDs: 5V Supply, HS Supply and LS Supply must be lit.
8. Digital pulse signal interfaces for high side or low side should be connected to CO2 (pin 1-2 and 5-6) or the BNC adaptors
9. Connect DC+ of high voltage supply to CO3 and DC- to CO4. It has to be noted that a 5uF capacitor is available on
board, but in most cases an external bulk capacitor has to connected for voltage stabilization. The applied voltage on
this connector must not exceed 900V.
10. Depending on type of the test and load, connect the load appropriately.
11. The board can now be tested.
4.1 Evaluation Board set up for various tests
The board can be used for performing simple double pulse tests for switching loss measurement of the SiC MOSFET and also to
evaluate the body diode behavior. Figure 12 shows the setup of the board for characterization of low side SiC MOSFETs.
Figure 12: Double pulse test set up for low side device characterization
