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MK71050-03 Evaluation Kit Hardware Manual 

 

PEXK71050-03_EvalKit_HardManual-01  

 

 

     

Notes

 

 
Precautions for the Specification 

 

1) Contents of the Specification are the information at the time of their issuance.

 

The information contained herein is subject 

to change without notice. 

 

2) LAPIS Semiconductor has used reasonable care in preparing the information included in the Specification, but LAPIS 

Semiconductor does not warrant that such information is error free. LAPIS Semiconductor assumes no liability whatsoever 
for any damages incurred by you resulting from errors in or omissions from the information included herein. 

 

    3) The technical information specified herein is intended only to show the typical functions of the Products and examples of 

application circuits for the Products.    No license, expressly or implied, is granted hereby under any intellectual property 
rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this 
document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights 
owned by third parties, arising out of the use of such technical information. 

 

4) The Specification contains information related to the LAPIS Semiconductor’s copyright and technical know-how. Any use 

of them other than pertaining to the usage of appropriate products is not permitted. Further, the Specification, in part or in 
whole, may not be reprinted or reproduced and disclosed to third parties without prior consent of LAPIS Semiconductor. 

 

Precautions for the Products 

 

Precautions for Safety 

 

1) The Products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, 

telecommunication equipment, home appliances, amusement equipment, etc.).     

 
2)

 

For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and 

consult with a LAPIS Semiconductor representative: transportation equipment (i.e. cars, ships, trains), primary 
communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, 
and power transmission systems. 

 
3)

 

Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power 

control systems, and submarine repeaters. 

 

4) The Products are designed for use in a standard environment and not in any special environments.     

Application of the Products in a special environment can deteriorate product performance.    Accordingly, verification and 
confirmation of product performance, prior to use, is recommended if used under the following conditions: 

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents 
[b] Use outdoors where the Products are exposed to direct sunlight, or in dusty places 

[c] Use in places where the Products are exposed to sea winds or corrosive gases, including   

Cl

2

, H

2

S, NH

3

, SO

2

, and NO

2

 

[d] Use in places where the rPoducts are exposed to static electricity or electromagnetic waves 
[e] Use in environment subject to strong vibration and impact. 

[f] Use in proximity to heat-producing components, plastic cords, or other flammable items 
[g] Use involving sealing or coating the Products with resin or other coating materials 
[h] Use of the Products in places subject to dew condensation 
 

    5) The Products might receive the radio wave interference from electronic devices such as Wireless LAN devices, Bluetooth 

devices, digital cordless telephone, microwave oven and so on that radiate electromagnetic wave. 

 

6) The Products are not radiation resistant. 
 

7) Verification and confirmation of performance characteristics of Products, after on-board mounting, is advised. 

 

8) Confirm that operation temperature is within the specified range described in the Specification. 

Содержание LAPIS MK71050-03

Страница 1: ...chnology and LAPIS Technology succeeded LAPIS Semiconductor s LSI business Therefore all references to LAPIS Semiconductor Co Ltd LAPIS Semiconductor and or LAPIS in this document shall be replaced wi...

Страница 2: ...PEXK71050 03_EvalKit_HardManual 02 MK71050 03 Evaluation Kit Hardware Manual Issue Date Mar 10 2015...

Страница 3: ...our Products in applications requiring a high degree of reliability as exemplified below please contact and consult with a LAPIS Semiconductor representative transportation equipment i e cars ships t...

Страница 4: ...trostatic sensitive product which may be damaged due to Electrostatic discharge Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won t be ap...

Страница 5: ...sibility for any damages or losses resulting non compliance with any applicable laws or regulations 2 When providing our Products and technologies contained in the Specification to other countries you...

Страница 6: ...tion Kit which enables Bluetooth LE compliant 2 4GHz band radio communication capability to Windows PC via USB The following related manual is available and should be referenced as needed MK71050 03 D...

Страница 7: ...tem structure 2 2 2 Composition of MK71050 03 USB dongle 3 3 Operation procedure 4 3 1 First setup 4 4 User Interface 5 4 1 Connecting uEASE 5 5 PCB Schematics 6 5 1 MK71050 03 wireless module 6 5 2 U...

Страница 8: ...act to your distributor or the ROHM s responsible sales The composition article contents Composition article Quantity MK71050 03 USB dongle Central MK71050 03 wireless module Central USB conversion bo...

Страница 9: ...ription PEXK71050 03_EvalKit_HardManual 01 2 2 General Description 2 1 System structure MK71050 03 USB dongle can be master role of Bluetooth LE connection or slave role of Bluetooth LE connection Fig...

Страница 10: ...USB dongle Number Name Symbol Description MK71050 03 wireless module MK71050 03 U1 Bluetooth LE wireless module B3U 3000P M S1 Reset switch of MK71050 03 ML610Q482 U2 U8 MCU Half pitch pin header J2...

Страница 11: ...be downloaded from following link http www ftdichip com Drivers VCP htm Insert USB dongle into USB connector on your PC Run the terminal software and set the below serial port setting Baud rate 38400...

Страница 12: ...nd uEASE module will be done as shown below picture As pin pitches between uEASE connector and cable for uEASE are different uEASE pitch conversion board has to be used Figure 4 1 MK71050 03 wireless...

Страница 13: ...MK71050 03 Evaluation Kit Hardware Manual 4 User Interface PEXK71050 03_EvalKit_HardManual 01 6 5 PCB Schematics 5 1 MK71050 03 wireless module Please refer to the next page...

Страница 14: ...MK71050 03 Evaluation Kit Hardware Manual 4 User Interface PEXK71050 03_EvalKit_HardManual 01 7 Figure 5 1 MK71050 03 wireless module...

Страница 15: ...MK71050 03 Evaluation Kit Hardware Manual 4 User Interface PEXK71050 03_EvalKit_HardManual 01 8 5 2 USB conversion board Figure 5 2 USB conversion board...

Страница 16: ...ry PEXK71050 03_EvalKit_HardManual 01 9 Revision History Page Document No Issue Date Previous Edition New Edition Description PEXK71050 03_Eval Kit_HardManual 01 2014 Sep 16 Draft 1st release PEXK7105...

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