RK3288 Hardware Design Guide
4 Thermal Dissipation
CPU is the maximum heat component on RK3288 production which is the main object for
thermal dissipation processing.
Other main heating components are PMIC, charger IC and its inductors, backlight IC and
power inductors. In addition, power traces with large currents (trace from DC socket to
charger IC, battery to VCC_SYS of PMU) will have thermal effect for whole machine. These
thermal sources should be placed respectively; keep trace as short, wide as possible for large
current sources.
Due to radiation diffusion characteristics of thermal, heat source should be the center of
CPU heat sink, make heat sink as a square or roundness instead of long strip. Heat sink
cooling effect will not be proportional to its size, 6cm*6cm graphite heat sink is the most
economic choice as Fig 4-3 from thermograph in below Fig 4-1.
Fig 4-1
Below three methods should be considered to improve heat conduction of PCB
：
Place more enough vias under the thermal components;
Place continuous copper on the surface layers;
Add copper content (use 1oz for each layer)
Содержание RK32 Series
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