RF-WM-3200B1
Shenzhen RF-star Technology Co., Ltd.
Page 28 of 35
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away
from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic
interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer,
the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly
affect the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz and 5 GHz physical
layer, for example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The chip antenna position on PCB is free space electromagnetic radiation. The location and layout of antenna is a
key factor to increase the data rate and transmission range.
