RF-BM-S02
Shenzhen RF-star Technology Co., Ltd.
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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-S02
4.4 Basic Operation of Hardware Design
1.
It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2.
Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3.
When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4.
The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer,
the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5.
Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6.
Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
