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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Package Components .................................................................................................................. 16
2.2 Other Tool Products Required for Development ........................................................................ 16
2.3 Name of Each Part ...................................................................................................................... 17
(1) System Configuration ........................................................................................................... 17
2.4 When Using the Emulator for the First Time ............................................................................. 18
(1) Making the MCU File ........................................................................................................... 18
(2) Setting the Work Area .......................................................................................................... 18
(3) Downloading Firmware ........................................................................................................ 19
(4) Self-check ............................................................................................................................. 19
Содержание Emulation Pod M30100T3-RPD-E
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