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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Terminology ............................................................................................................................... 16
2.2 Package Components .................................................................................................................. 17
2.3 Other Tool Products Required for Development ........................................................................ 17
2.4 Name of Each Part ...................................................................................................................... 18
(1) System Configuration ........................................................................................................... 18
(2) Inside of Emulation Pod ....................................................................................................... 19
2.5 When Using the Emulator for the First Time ............................................................................. 20
Содержание Emulation Pod for M30240 Group MCUs M30240T-RPD-E
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