RadiSys 6200plus Series, Руководство по обслуживанию

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Operations
6 6200
plus
Series Service Manual
0.
000
0.000
Tower Base
19.101
17.821
16.996
12.895
1.365
9.270
0.000
5.645
2.020
0.
000
10.
30
1
5.
086
0.
000
17.
11
0
19.186
10.460
8.980
6.730
3.730
1.480
0.
000
18.
06
0
0.
950
19.
01
0
Figure 3
Dimensions
A Note on Thermal Specifications
The technology and power density of the microprocessor is rapidly increasing. The 80386 required less than a few hundred milliampere of
current. The 80486DX4 peaked at less than 1.5 A and dissipated less than 5 watts of power. The 233 MHz Pentium
®
processor with
MMX ™ technology requires up to 6.5 A and dissipates as much as 17 W. The Pentium II processor dissipates even more. Power levels
have increased to a level that greatly affects the ability of the equipment to effectively dissipate energy.
RadiSys is continually working to ensure that its products will conform to thermal specifications. However, we can only work within known
or anticipated hardware and software configurations. One peripheral device installed within a chassis can significantly alter operating
temperature. Also, software applications can cause variations of 20
° C or more. Even the cable layout within the chassis can affect airflow
and thereby performance.
RadiSys validates the operating specifications of its products by testing with the “hottest” possible hardware and software configuration, to
maximize the power supply draw and generate a worst-case scenario. Despite these efforts, the specifications herein are only
benchmarks and should be regarded as such.