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Quick BGA 2025, Руководство по эксплуатации

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QUICK BGA 2025

 

 

BGA/CSP Rework Station

 

 

 

 

 

 

 

 

 

 

 

 

Operation Manual 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thank you for purchasing our BGA/SMD Rework System. The system is exclusively designed for reworking 

and soldering SMD component. Please carefully read this manual before operating the system. Store this 

manual in a safe, easily accessible place for future reference.

 

Содержание BGA 2025

Страница 1: ...k you for purchasing our BGA SMD Rework System The system is exclusively designed for reworking and soldering SMD component Please carefully read this manual before operating the system Store this man...

Страница 2: ...g the PCB temperature and the encapsulation temperature the technology of re flow soldering controlled by closed loop ensures the precise and smaller technical window even heat distribution and approp...

Страница 3: ...wing parts are included and intact Main Unit BGA2025 Sirocco nozzle PC and LCD Display Screen BGA2025 Operation Manual K type sensors Video line BGA Toolbox Note The parts will be packed according to...

Страница 4: ...y an experienced and authorized technician or expert or contact with service agent and factory The unit with dangerous voltage The inexperienced maintenance is dangerous for the operators 5 Specificat...

Страница 5: ...B The real temperature of bottom sirocco heater KIR The real temperature of bottom Infrared heater IRT The real temperature of IR sensor inspecting S0 Heating time from T0 to T1 S1 Heating time from T...

Страница 6: ...S1 T2 S2 T3 S3 TL TIR TB1 TB2 BF A SEN TYP CA L 0 90 40 145 50 160 55 200 30 183 150 140 160 9 0 0 0 1 90 55 145 50 155 40 200 20 183 165 130 150 9 0 1 0 2 90 40 140 50 150 50 200 15 183 160 125 145...

Страница 7: ...e LCD please unscrew the fixed knob and lock screw to adjust the LCD to suitable height and then screw down the fixed knob and lock screw Fixed screw Lock screw LCD Fixed knob 6 3 Connect the Equipmen...

Страница 8: ...TOS The system is a closed loop temperature controlling Testing the temperature of BGA surface with infrared temperature sensor Besides bottom sirocco and infrared heater test the temperatures with o...

Страница 9: ...play window Air blow meter APERTURE ADJUSTING The aperture system of the top infrared heater is adjustive from 20mm 60mm to 60mm 60mm by one adjustment knob Unscrew the knob before adjusting and adjus...

Страница 10: ...CB move the infrared heater in X axis to ensure even heating of the PCB Nozzle of the sirocco heater PCB fixture Bottom infrared heater Bottom Preheater The size of the bottom infrared preheater is 45...

Страница 11: ...ixture Lock Knobs when the elements precise align screw down the lock knobs before micro adjusting Turn micro adjusting knob one for moving the PCB fixture to left or right The PCB fixture to right wh...

Страница 12: ...gain K FOCUS and FOCUS key For camera focusing L ZOOM and ZOOM key Zooming the image M RED and RED key Adjusting the brightness of the top red light N WHITE and WHITE key Adjusting the brightness of t...

Страница 13: ...nient by micro adjusting Aligning arm inside Aligning arm outside Nozzle Instruction The nozzle will act during the process of placing and sucking the chip SUCKER and SUCKER keys control the nozzle mo...

Страница 14: ...ature is 80 TC and TB show room temperatures in initial state Press SET key to select the T0 080 and then press SET key again into the setting state Cursor is in the 1 s digit of the selecting item Pr...

Страница 15: ...word 000 If user needs to modify the password inputting the new password again with the above method It will display Saving Password when successfully modify Note it must input the right password if u...

Страница 16: ...processes all have password protection and authority setting to ensure the reliable technics Note It must be in the DATA interface to cancel the calibrating Setting the CAL parameter as OFF to cancel...

Страница 17: ...temperature rises to T2 when to the time S1 During this time PCB and component pre heating is finished and the solder is activated Use the UP DOWN RIGHT LEFT RIGHT SET and SAVE key to set the values...

Страница 18: ...splayed and used for process controlling Use the UP DOWN RIGHT LEFT RIGHT SET and SAVE key to set the values of TEL when modifying the parameters Password It is used for setting password It is designe...

Страница 19: ...unds unvaryingly the top heater move upwards Top cooling fan blows cooling air and bottom sirocco nozzle stop blowing warm air to blow cooling air The effect of cooling is better when blowing cooling...

Страница 20: ...cally when pressing PASTE The aligning process is over and it s the time to solder 2 3 4 1 4 2 4 3 4 4 7 8 9 1 9 2 9 3 9 3 Intelligent Processes Instruction BGA2025 has three intelligent processes tha...

Страница 21: ...o top begin pressing SUCK when the system in idle Top heating arm stop downwards Delay one second Top heating arm downwards Alignment arm turn to outwards Nozzle up to top Page 20 Is the Nozzle switch...

Страница 22: ...losed Is the Nozzle switch touched Close pump Delay one second Heating arm up to top Nozzle up to top B END A NOTE Process runs from B after pressing EXIT key at any time in sucking process After clos...

Страница 23: ...Nozzle switch be touched or down to bottom Is the Nozzle switch touched B Is the Nozzle switch touched Heating arm down to bottom B A Heating arm downwards Nozzle stop upwards Nozzle upwards Nozzle d...

Страница 24: ...YES A B Delay one second Nozzle downwards Nozzle switch be touched or down to bottom Heating arm up to top C END Nozzle up to top Delay one second Close the pump NOTE Process runs from C after press E...

Страница 25: ...ssing up and down adjusting button of the heating arm or not Delay two seconds Top temperature is bigger than T0 and up to time A Adjust the heating arm to upwards or downwards Press up and down adjus...

Страница 26: ...perature is bigger than T1 and up to time A YES NO YES Control calefactive temperatureT1 T2 Top temperature is bigger than T3 and up to time NO Control calefactive temperatureT2 TL Top temperature is...

Страница 27: ...re TL T3 Top temperature is bigger than T3 and up to time With sound hint or not Control constant temperature on TL T3 De solder process or not Nozzle downwards Touch the sucking switch Nozzle down to...

Страница 28: ...nting delay time END Heating arm up to top No heating on top No sirocco heating on bottom Heater arm stop upwards E Note After the heating process run the process from E after sucking the chip when pr...

Страница 29: ...they aren t superposition please adjust Micro adjustment Knobs of fixture until the calibration tube and hole completely superpose After superposing please don t do any change to the calibration plat...

Страница 30: ...value and the calibrating parameter will be write into the process and save 4 If necessary you can repeat the above steps to calibrate once again Normally the temperature is correct not to adjust Note...

Страница 31: ...the towel with cleaning oil to clean PCB fixture and orbit Replace Suction Pad If you want to replace the Suction Pad please turn off power and replace it after the vacuum suction nozzle and Top Heat...

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