5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 74 / 83
Figure 37: Thermal Dissipation Area on Bottom Side of Module
There are other measures to enhance heat dissipation performance:
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Add ground vias as many as possible on PCB.
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Maximize airflow over/around the module.
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Place the module away from other heating sources.
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Module mounting holes must be used to attach (ground) the device to the main PCB ground.
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It is NOT recommended to apply solder mask on the main PCB
where the module’s thermal
dissipation area is located.
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Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical
enclosure) of the application device that integrates the module so that it provides good thermal
dissipation.
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Customers may also need active cooling to pull heat away from the module.
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If possible, add a heatsink on the top of the module. A thermal pad should be used between the
heatsink and the module, and the heatsink should be designed with as many fins as possible to
increase heat dissipation area.
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
NOTE