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Wi-Fi&Bluetooth Module Series

FC64E_Hardware_Design

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Figure Index

Figure 2 : Pin Assignment (Top View) .........................................................................................................20
Figure 3 : Power Supply Block Diagram ......................................................................................................24
Figure 4 : Turn-on and Turn-off Sequence ..................................................................................................25
Figure 5 : WLAN Application Interface Connection .....................................................................................25
Figure 6 : PCIe Interface Connection .......................................................................................................... 27
Figure 7 : Block Diagram of Bluetooth Application Interface Connection ...................................................28
Figure 8 : Reference Circuit with Translator Chip ....................................................................................... 29
Figure 9 : PCM Interface Connection .......................................................................................................... 30
Figure 10 : Requirements of WLAN_SLP_CLK .......................................................................................... 31
Figure 11 : Reference Circuit for RF Antenna Interfaces ............................................................................33
Figure 12 : Microstrip Design on a 2-layer PCB ..........................................................................................33
Figure 13 : Coplanar Waveguide Design on a 2-layer PCB ....................................................................... 33
Figure 14 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ................... 34
Figure 15 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ................... 34
Figure 16 : Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................36
Figure 17 : Mechanicals of U.FL-LP Connectors (Unit: mm) ......................................................................36
Figure 18 : Space Factor of Mated Connector (Unit: mm) ..........................................................................37
Figure 19 : Module Top and Side Dimensions (Top and Side View) ..........................................................47
Figure 20 : Module Bottom Dimension (Bottom View) ................................................................................48
Figure 21 : Recommended Footprint (Top View) ........................................................................................49
Figure 22 : Top & Bottom View of FC64E ................................................................................................... 50
Figure 23 : Recommended Reflow Soldering Thermal Profile ................................................................... 52
Figure 24 : Carrier Tape Dimension Drawing ..............................................................................................54
Figure 25 : Plastic Reel Dimension Drawing ...............................................................................................54
Figure 26 : Packaging Process ....................................................................................................................55

Содержание FC64E

Страница 1: ...FC64E Hardware Design Wi Fi Bluetooth Module Series Version 1 0 1 Date 2021 09 08 Status Preliminary...

Страница 2: ...orts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis We may revise or restate th...

Страница 3: ...ny and all warranties arising from the course of dealing or usage of trade Disclaimer a We acknowledge no liability for any injury or damage arising from the reliance upon the information b We shall b...

Страница 4: ...erference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles op...

Страница 5: ...Wi Fi Bluetooth Module Series FC64E_Hardware_Design 4 53 metal powders Quectel Confidential...

Страница 6: ...cument Revision History Version Date Author Description 2021 01 19 Soni RAO Lucas HUANG Creation of the document 1 0 0 2021 01 19 Soni RAO Lucas HUANG Preliminary 1 0 1 2021 09 08 Soni RAO Lucas HUANG...

Страница 7: ...WLAN_EN 25 3 5 2 PCIe Interface 26 3 6 Bluetooth Application Interface 27 3 6 1 BT_EN 28 3 6 2 UART Interface 28 3 6 3 BT_WAKEUP_HOST and HOST_WAKEUP_BT 29 3 6 4 PCM Interface 29 3 7 Other Interfaces...

Страница 8: ...Performances 45 4 7 1 Conducted RF Output Power 45 4 7 2 Conducted RF Receiving Sensitivity 46 4 8 ESD 46 5 Mechanical Information 47 5 1 Mechanical Dimensions 47 5 2 Recommended Footprint 49 5 3 Top...

Страница 9: ...ntenna Requirements 35 Table 17 Absolute Maximum Ratings 38 Table 18 Recommended Operating Conditions 39 Table 19 General DC Electrical Characteristics 39 Table 20 Operating and Storage Temperatures 4...

Страница 10: ...er PCB 33 Figure 13 Coplanar Waveguide Design on a 2 layer PCB 33 Figure 14 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground 34 Figure 15 Coplanar Waveguide Design on a 4 layer P...

Страница 11: ...ce complies with FCC radiation exposure limits set forth for an uncontrolled environment In order to avoid the possibility of exceeding the FCC radio frequency exposure limits human proximity to the a...

Страница 12: ...ntennas and or higher gain antennas may require additional authorization for operation 4 The max allowed antenna gain is WIFI 2 4G BT 0 73dBi WIFI 5G 1 14 dBi for external antenna In the event that th...

Страница 13: ...rte qu une distance de 20 cm est respect e entre l antenne et les utilisateurs et 2 Le module metteur peut ne pas tre co mplant avec un autre metteur ou antenne Tant que les 2 conditions ci dessus son...

Страница 14: ...erational failure Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology Caution i The device for o...

Страница 15: ...angle s necessary to remain compliant with the e i r p elevation mask requirement set forth in section 6 2 2 3 shall be clearly indicated 1 1 Special Mark Table 1 Special Mark Mark Definition When an...

Страница 16: ...interface for Bluetooth FC64E can provide WLAN and Bluetooth functions 2 2 Key Features The following table describes the key features of the module Table 2 Key Features Features Details Power Supply...

Страница 17: ...BLE BLE long range Transmission Data Rates 802 11b 1 Mbps 2 Mbps 5 5 Mbps 11 Mbps 802 11a g 6 Mbps 9 Mbps 12 Mbps 18 Mbps 24 Mbps 36 Mbps 48 Mbps 54 Mbps 802 11n HT20 MCS0 7 HT40 MCS0 7 802 11ac VHT20...

Страница 18: ...EE compliant RF Antenna Interfaces ANT_WIFI0 ANT_WIFI1 ANT_BT 50 impedance Physical Characteristics Size 18 0 15 mm 19 9 0 15 mm 2 1 0 2 mm Package LCC Weight TBD Temperature Range Operating temperatu...

Страница 19: ...elop applications with FC64E module conveniently Quectel supplies the evaluation board FC6xE M 2 Antenna cable antenna and others to control or test the module For more details see document 1 and docu...

Страница 20: ...Description The module is equipped with 52 LCC pins and 28 LGA pins The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module Power supply WLAN a...

Страница 21: ...Wi Fi Bluetooth Module Series FC64E_Hardware_Design 20 53 3 2 Pin Assignment Figure 2 Pin Assignment Top View 1 VDD_3V3 is optional according to module OC 2 Please keep all RESERVED pins open NOTE...

Страница 22: ...upply Pin Name Pin No I O Description DC Characteristics Comment VDD_CORE_VL 51 52 PI Provide 0 95 V for the module s main part Vmin 0 9 V Vnom 0 95 V Vmax 1 0 V VDD_CORE_VM 48 PI Provide 1 35 V for t...

Страница 23: ...differential impedance of 85 PCIE_REFCLK_P 2 AI PCIe reference clock PCIE_TX_M 4 AO PCIe transmit PCIE_TX_P 5 AO PCIe transmit PCIE_RX_M 7 AI PCIe receive PCIE_RX_P 8 AI PCIe receive PCIE_CLKREQ_ N 1...

Страница 24: ...t VOLmax 0 45 V VOHmin 1 35 V HOST_WAKE_ BT 22 DI Host wakes up Bluetooth VILmin 0 3 V VILmax 0 63 V VIHmin 1 17 V VIHmax 2 1 V RF Antenna Interfaces Pin Name Pin No I O Description DC Characteristics...

Страница 25: ...owing figure shows the recommended turn on and turn off sequence of the module RESERVED Interfaces Pin Name Pin No Comment RESERVED 9 55 56 59 65 66 Keep them open Pin Name Pin No Description Min Typ...

Страница 26: ...erface connection between the module and the host If you need WLAN wakeup function connect the pin 9 of module with the host corresponding pin first and contact Quectel Technical Support if necessary...

Страница 27: ...he PCIe interface connection between the module and the host Pin Name Pin No I O Description Comment WLAN_EN 13 DI WLAN function enable control 1 8 V power domain Active high Do not float this pin Pin...

Страница 28: ...uld be 85 10 The maximum trace length of each differential pair PCIE_TX_P M PCIE_RX_P M and PCIE_REFCLK_P M should be less than 200 mm and trace length matching within each differential pair should be...

Страница 29: ...6 2 UART Interface The module supports an HCI UART as defined in Bluetooth Core Specification Version 4 0 The UART supports hardware flow control and it is used for data transmission with host It sup...

Страница 30: ...KEUP_BT BT_WAKEUP_HOST and HOST_WAKEUP_BT are used to wake up the host and the module Table 10 Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT 3 6 4 PCM Interface The PCM interface is for audio ov...

Страница 31: ...768 kHz clock is used in low power modes such as IEEE power saving mode and sleep mode It serves as a timer in various power saving schemes and to maintain basic logic operations when the module is in...

Страница 32: ...Definition of SW_CTRL 3 8 RF Antenna Interfaces This information will be included in future revisions of this document Parameter Comments Min Typ Max Unit t xoh Sleep clock logic high 4 58 4 58 25 94...

Страница 33: ...enna interfaces the reference design is the same It is recommended to reserve a type matching circuit for better RF performance and the type matching components C1 C2 R1 should be placed as close to t...

Страница 34: ...ly determined by the trace width W the materials dielectric constant the height from the reference ground to the signal layer H and the spacing between RF traces and grounds S Microstrip or coplanar w...

Страница 35: ...nd should be fully connected to ground The distance between the RF pins and the RF connector should be as short as possible and all the right angle traces should be changed to curved ones The recommen...

Страница 36: ...for antennas Table 16 Antenna Requirements 3 8 5 RF Connector Recommendation If RF connector is used for antenna connection it is recommended to use U FL R SMT connector provided by Hirose Type Requi...

Страница 37: ...e 16 Dimensions of the U FL R SMT Connector Unit mm U FL LP serial connectors listed in the following figure can be used to match the U FL R SMT Figure 17 Mechanicals of U FL LP Connectors Unit mm The...

Страница 38: ...Wi Fi Bluetooth Module Series FC64E_Hardware_Design 37 53 Figure 18 Space Factor of Mated Connector Unit mm For more details visit http www hirose com...

Страница 39: ...lectrical Characteristics The following table shows the absolute maximum ratings Table 17 Absolute Maximum Ratings The following table shows the recommended operating conditions of the module Paramete...

Страница 40: ...e specified Table 19 General DC Electrical Characteristics Parameter Min Typ Max Unit VDD_CORE_VL 0 9 0 95 1 0 V VDD_CORE_VM 1 3 1 35 1 42 V VDD_CORE_VH 1 85 1 95 2 05 V VDD_IO 1 71 1 8 1 89 V VDD_RF...

Страница 41: ...ture range the module is IEEE compliant 3 In OFF state the Wi Fi driver is uninstalled and WLAN_EN is pulled down 4 In Idle state the Wi Fi is enable but not connected Parameter Min Typ Max Unit Opera...

Страница 42: ...0 MCS9 326 02 165 52 103 38 2 9 370 09 5G 802 11ax HE80 MCS11 409 37 168 34 99 36 2 56 455 29 2 2 2G 802 11n HT20 MCS0 386 73 173 39 123 84 2 92 717 42 2G 802 11n HT40 MCS7 394 78 179 08 118 99 2 83 6...

Страница 43: ...3 2 91 1087 11n MCS0 HT20 11ac MCS0 VHT20 424 04 306 3 223 24 2 91 1342 11n MCS7 HT40 11ac MCS9 VHT80 672 59 319 42 218 2 2 9 1127 11ax MCS0 HE20 429 49 311 57 232 78 2 91 1355 11ax MCS11 2G HE40 5G H...

Страница 44: ...Mbps 11 13 dBm 802 11n HT20 MCS0 13 15 dBm 802 11n HT20 MCS7 10 12 dBm 802 11n HT40 MCS0 13 15 dBm 802 11n HT40 MCS7 10 12 dBm 802 11ac VHT20 MCS0 13 15 dBm 802 11ac VHT20 MCS8 10 12 dBm 802 11ac VHT...

Страница 45: ...Mbps 87 5 dBm 802 11g 6 Mbps 91 5 dBm 802 11g 54 Mbps 72 5 dBm 802 11n HT20 MCS0 92 dBm 802 11n HT20 MCS7 72 dBm 802 11n HT40 MCS0 89 dBm 802 11n HT40 MCS7 69 dBm 802 11ax HE20 MCS0 92 dBm 802 11ax HE...

Страница 46: ...Output Power 802 11ac VHT20 MCS8 66 dBm 802 11ac VHT40 MCS0 87 dBm 802 11ac VHT40 MCS9 62 dBm 802 11ac VHT80 MCS0 84 dBm 802 11ac VHT80 MCS9 58 dBm 802 11ax HE20 MCS0 90 dBm 802 11ax HE20 MCS11 60 dBm...

Страница 47: ...r example wearing anti static gloves during the development production assembly and testing of the module adding ESD protective component to the ESD sensitive interfaces and points in the product desi...

Страница 48: ...rmation This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unless otherwise specified 5 1 Mechanical...

Страница 49: ...Wi Fi Bluetooth Module Series FC64E_Hardware_Design 48 53 Figure 20 Module Bottom Dimension Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE Pin1...

Страница 50: ...e 21 Recommended Footprint Top View 1 Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience 2 To keep the reliability o...

Страница 51: ...esign 50 53 5 3 Top and Bottom Views Figure 22 Top Bottom View of FC64E Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label please r...

Страница 52: ...n 10 e g a drying cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storag...

Страница 53: ...n the surface of stencil thus making the paste fill the stencil openings and then penetrate to the PCB Apply proper force on the squeegee to produce a clean stencil surface on a single pass To guarant...

Страница 54: ...ormal coating is necessary for the module do NOT use any coating material that may chemically react with the PCB or shielding cover and prevent the coating material from flowing into the module 4 Avoi...

Страница 55: ...ackaging and details are as follow 6 3 1 Carrier Tape Dimension details are as follow Figure 24 Carrier Tape Dimension Drawing Table 31 Carrier Tape Dimension Table Unit mm 6 3 2 Plastic Reel Figure 2...

Страница 56: ...nd use the cover tape to cover them then wind the heat sealed carrier tape to the plastic reel and use the protective tape for protection One plastic reel can load 250 modules Place the packaged plast...

Страница 57: ...M 2_User_Guides 3 Quectel_RF_Layout_Application_Note 4 Quectel_Module_Secondary_SMT_Application_Note Abbreviation Description AFH Adaptive Frequency Hopping AP Access Point BPSK Binary Phase Shift Key...

Страница 58: ...ntrol Mbps Megabits per second MCS Modulation and Coding Scheme MU MIMO Multi User Multiple Input Multiple Output PA Power Amplifier PCB Printed Circuit Board PCM Pulse Code Modulation QAM Quadrature...

Страница 59: ...VIHmin Minimum High level Input Voltage VILmax Maximum Low level Input Voltage VILmin Minimum Low level Input Voltage VOLmax Maximum Low level Output Voltage VOHmin Minimum Output High level Output V...

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