LTE Standard Module Series
EG915U-EU_Hardware_Design 70 / 81
8
Storage, Manufacturing &
Packaging
8.1. Storage Conditions
The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage
restrictions are shown as below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35
–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 24 hours
6
in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 24 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫
The module is not stored in Recommended Storage Condition;
⚫
Violation of the third requirement above occurs;
⚫
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫
Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
⚫
The module should be baked for 8 hours at 120 ±5 °C;
⚫
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
6
This floor life is only applicable when the environment conforms to
IPC/JEDEC J-STD-033
.
Содержание EG915U-EU
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