LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design 21 / 106
3
Application Interfaces
3.1. General Description
EG91 series module is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads
that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads
are described in detail in the following chapters:
Power
supply
(U)SIM
interfaces
USB
interface
UART
interfaces
PCM and I2C interfaces
SPI
interface
Status
indication
USB_BOOT
interface