LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design 66 / 78
Figure 33: Recommended Stencil Design (Top View)
1.
For easy maintenance of the module, please keep about 3mm between the module and other
components on the
host PCB.
2. All reserved pins must be kept open.
3. The thickness of stencil should be stepped-up to 0.18mm. The stencil openings should be shrunken
inward by 0.30mm and moved outward by 0.40mm. Cut four 1.00×1.00mm openings with 0.05mm
square chamfer on the pads in the center.
NOTES