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I
NTRODUCTION
A
BOUT
THE
S
YSTEM
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1.1 Introduction
High Density 2U4N design for maximum performance
The Rackgo X F03A is designed for the highest compute density with four nodes in a 2 OU
space. Each node can install up to two SATADOMs for the operating system and up to four
extra hot-swappable SSD/HDDs for cache or data storage. Its RAID-ready configuration
preserves data integrity and avoids data corruption.
Vanity Free Design for better MTBF
By centralizing power supplies in the rack and removing unnecessary components from
the system, the F03A enhances system MTBF by 58% compared to other conventional
2U4N systems in the market. This will avoid system downtime caused by component fail-
ure and minimize maintenance efforts.
VGA-redirection for on-site troubleshooting
F03A offers an optional dual-port 10Gbps SFP+ mezzanine card with an ASPEED 2300
chip, providing VGA-redirection for datacenters requiring on-site troubleshooting.
Specifications
Table 1: System Specifications
S
PECIFICATION
D
ESCRIPTION
Form Factor (LxWxH)
2 OU Rackmount, 4 nodes
839.47mm x 535.94mm x 92.96mm
33.05" x 21.1" x 3.66"
MB Size (WxL)
165.1mm x 508mm
6.5" x 20"
Processor
(2) Intel® Xeon® processor E5-2600/ E5-2600 v2 product family per node, up to
130W
Chipset
Intel® C602 chipset
SAS Controller
Intel® C602 upgrade ROM #1 (optional)
Intel® C602 upgrade ROM #2 (optional)
Memory
(16) DDR3 800/1066/1333/1600/1866 MHz ECC UDIMM/RDIMM/LRDIMM slots per
node
Drive Bay
SKU 1: (2) 2.5" SATA/SAS hot-plug HDD trays per node
SKU 1: (4) 2.5" SATA/SAS hot-plug HDD trays per node
Onboard Storage
Device
(3) Mini-SAS connectors signal from Intel® C602
(2) SATA connectors signal from Intel® C602
HDD Backplane
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