Qiyang IAC-IMX8MM-Kit, Руководство по оборудованию

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IAC-IMX8MM-Kit Embedded Development Kit Hardware Manual
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Catalogue
Note: This manual mainly introduces the hardware interfaces of the development board. ........................................4
I. Preface .....................................................................................................................................................................4
1.1 Company Profile: ..........................................................................................................................................4
1.2
、 IAC-IMX8MM-KIT Development board ..................................................................................................5
II.System Composition ...............................................................................................................................................6
2.1 Chip Summary ..............................................................................................................................................6
2.2
、 Mainboard resource ：
...............................................................................................................................9
2.3
、
SOM Resource
：
.....................................................................................................................................10
Ⅲ .Functions on Board .............................................................................................................................................. 11
3.1. Basic Function Description :......................................................................................................................12
3.2. DIP Switch Setting .....................................................................................................................................13
3.3. Pin Definition: ...........................................................................................................................................14
Ⅳ
.Structure & Size: .................................................................................................................................................25
4.1.SOM Dimension .........................................................................................................................................26
4.2.Carrier Board Dimension: ...........................................................................................................................27
Ⅴ .Connection Picture ..............................................................................................................................................29
Ⅵ
.Electrical Property ...............................................................................................................................................30
Ⅶ
.Software Description: ..........................................................................................................................................31
Ⅷ .Remark.................................................................................................................................................................31