IAC-IMX8MM-Kit Embedded Development Kit Hardware Manual
Any question, please send E-mail :
Page 10 of 32
Sales E-mail
Website
:http://www.qiytech.com
©2012 Qiyangtech
Copyright
Mechanic
al Chart
Carrier Boardd’s Structure & Size
Elect
ric
a
l
Pr
ope
rt
y
Size
Core Board:55mm*60mm, 8-layer high precision immersion gold process
Back Board: 200mm*130mm
，
4-layer high precision immersion gold
process
Power
Consumpt
ion
≤
5W (Non-loaded consumption)
Operation
Temperatu
re
-40
℃
~ +85
℃
( industrial level )
，
0
℃
~ +85
℃
（
Consumer Level,
According to customers’ requirements
）
Operation
Humidity
5% ~ 95%, Non-Condensing
2.3
、
SOM Resource
：
IAC-IMX8MM adopts 8-layer high precision immersion gold process PC board and high glass transition
temperature material with reliable electrical specification and disturbance rejection behaviour. SOM integrates CPU,
LPDDR4, eMMc, power management circuits and so on. More than 150 pin from board to board connector apply
to IAC-IMX8MM to expand its hardware resource. According to Pin status and multiplex combination of different
interface functions, back panel would be designed.
Chart 2
