IRDA-WELDER T-890 USER MANUAL
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3).
Adjust the infrared lamp temperature sensor:
Put the infrared lamp temperature sensor on or around the chip. Then adjust the
place of PCB board preheat temperature sensor, letting the sensor contacts the
preheat plate well. In order to let the temperature measurement exact, put some flux
around the chip and the head of sensor. At the same time, the BGA pad will be in
good condition. Can effectively prevent the pad be adhered and prevent the pad has
tin burr.
3.
Sealing off/repair process:
The general sealing off process: fasten the PCB board, adjust it and the place of lamp,
make the infrared lamp laser aim at the chip and adjust the height of the lamp, place
the infrared lamp temperature sensor, put some flux, set the temperature of preheat
plate. Then choose the temperature wave of the lamp, turn on the preheat plate and
infrared lamp to heat up. When reach the peak temperature or the chip pad melts, put
away the chip by the tweezer or vacuum nozzle. After carry out the infrared lamp
temperature wave, it comes back automatically. When the main body cools down well,
you should turn off the power supply.
The general reflow process operation: the operation is about the same to the sealing
off. The differences are as the follow: first clean the pad and plant the solder ball,
preheat up the PCB board, place the chip directly, preheat up according the solder
ball reflow temperature, reflow and weld and cool down.
Sealing off/repair various kinds of the components, like CPU and GAP socket.
The operation is as follow: first use the aluminized paper to mantle the PCB fear heat
part and the other components. Then fix well the PCB board on the PCB board
