Safety Instructions, Warnings, and Notes
EN 6
LC4.2E AA
2.
Device Replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
To reflow the solder, apply a temperature profile according to
the
IC data sheet
. So as not to damage neighbouring
components, it may be necessary to reduce some
temperatures and times.
More Information
For more information on how to handle BGA devices, visit this
URL:
http://www.atyourservice.ce.philips.com
(needs
subscription). After login, select “Magazine”, then go to
“Workshop Information”. Here you will find Information on how
to deal with BGA-ICs.
2.3.4
Lead Free Solder
Some PWBs in this chassis are “lead-free
prepared
”. This is
indicated on the PWB by the PHILIPS lead-free logo (either by
a service-printing or by a sticker). It does not mean that lead-
free solder is actually used!
Figure 2-2 Lead-free logo
2.3.5
Practical Service Precautions
•
It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
•
Always respect voltages
. While some may not be
dangerous in themselves, they can cause unexpected
reactions - reactions that are best avoided. Before reaching
into a powered TV set, it is best to test the high voltage
insulation. It is easy to do, and is a good service precaution.
P
b
