Philips HTS3180, Руководство по обслуживанию

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3. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder
from all pins of the flat pack-IC. When you use
solder flux which is applied to all pins of the flat
pack-IC, you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid
mounting point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip
soldering iron or hot air blower, pull up the wire
as the solder melts so as to lift the IC leads
from the CBA contact pads as shown in
Fig.S-1-5.
4. Bottom of the flat pack-IC is fixed with glue
to the CBA; when removing entire flat pack-IC,
first apply soldering iron to center of the flat
pack-IC and heat up. Then remove (glue will
be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must
be taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
2. Installation
1. Using desoldering braid, remove the solder
from the foil of each pin of the flat pack-IC on
the CBA
so you can install a replacement flat pack-IC
more easily.
2. The “
●
” mark on the flat pack-IC indicates
pin 1. (See Fig. S-1-7.) Be sure this mark
matches the 1 on the PCB when positioning
for installation. Then presolder the four
corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure
that none of the pins have solder bridges.
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