CBTD3306
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 1 May 2012
11 of 17
NXP Semiconductors
CBTD3306
Dual bus switch with level shifting
Fig 15. Package outline SOT530-1 (TSSOP8)
UNIT
A1
A
max.
A2
A3
bp
L
HE
Lp
w
y
v
c
e
D
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.85
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.70
0.35
8
°
0
°
0.1
0.1
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.5
SOT530-1
MO-153
00-02-24
03-02-18
w
M
bp
D
Z
e
0.25
1
4
8
5
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
v
M
A
X
A
y
2.5
5 mm
0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
1.1
pin 1 index