3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
To Solid
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
7-3
Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC
Содержание BDP9600/51
Страница 20: ...9 2 Fig D3 Fig D7 Fig D4 Cabinet Disassembly Instructions Fig D5 Fig D8 02 04 05 06 05 05 03 Fig D6 08 ...
Страница 21: ...9 3 Cabinet Disassembly Instructions Fig D10 Fig D12 Fig D13 Fig D11 07 Fig D9 ...
Страница 33: ...Output Board Layout Diagram ...
Страница 36: ...VFD Diaplay Board Layout Diagram 15 6 15 6 ...
Страница 38: ...MCU Board Layout Diagram 15 8 15 8 ...
Страница 40: ...Decoder Board Layout Diagram 15 10 15 10 ...
Страница 42: ...Power Board Layout Diagram 15 12 15 12 ...
Страница 45: ...Revision List Revision List Version 1 0 Initial Release Version 1 1 Addition of BDP9600 51 17 1 ...