3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-37PE30B / TH-42PE30B
Содержание TH-42PE30B
Страница 5: ...1 Applicable signals 5 TH 37PE30B TH 42PE30B ...
Страница 15: ...7 Location of Lead Wiring 7 1 Lead of Wiring 1 15 TH 37PE30B TH 42PE30B ...
Страница 16: ...7 2 Lead of wiring 2 16 TH 37PE30B TH 42PE30B ...
Страница 17: ...7 3 Lead of wiring 3 17 TH 37PE30B TH 42PE30B ...
Страница 18: ...7 4 Lead of wiring 4 7 5 Lead of wiring 5 18 TH 37PE30B TH 42PE30B ...
Страница 19: ...7 6 Lead of wiring 7 19 TH 37PE30B TH 42PE30B ...
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Страница 26: ...9 3 Option Description 26 TH 37PE30B TH 42PE30B ...
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Страница 30: ...10 4 IIC mode structure following items value is sample data 30 TH 37PE30B TH 42PE30B ...
Страница 34: ...12 Alignment 12 1 Pedestal setting 34 TH 37PE30B TH 42PE30B ...
Страница 35: ...12 2 PAL panel white balance 35 TH 37PE30B TH 42PE30B ...
Страница 36: ...12 3 PC panel white balance 36 TH 37PE30B TH 42PE30B ...
Страница 37: ...12 4 Sub brightness setting 12 5 ABL Level 37 TH 37PE30B TH 42PE30B ...
Страница 71: ...15 Block and Schematic Diagrams 15 1 Schematic Diagram Notes TH 37PE30B TH 42PE30B 71 ...
Страница 137: ...16 Parts Location 137 TH 37PE30B TH 42PE30B ...
Страница 138: ...17 Packing Exploded Views 138 TH 37PE30B TH 42PE30B ...
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