Panasonic SP28P, Руководство по эксплуатации

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Page 1-7
GENERAL DESCRIPTION
1
1E4C-E-OMA01-A02-00
1-2 Production Process
This section describes the production mechanism in due order.
1
. Board is transported from the previ-
ous process to the conveyor (left).
2
. It is transported from the conveyor
(left) to the board holder.
3
. It is clamped in the Y-axis, and the
support rises up.
∗
That the support rises up and then the board is
clamped is also available.
4
. The board holder moves to the posi-
tion of recognition camera.
5
. The board is recognized.
1
. The board holder moves to the print-
ing position.
2
. The lifter rises up to the surface of
mask, then solder is printed by
squeegee.
3
. The lifter lowers from the surface of
mask to the transport height.
∗
When the specified printing count has been
performed, mask is cleaned.
(
To the next page )
1
. Board is unclamped and the support
lowers.
2
. It is transported from the board
holder to the conveyor (right).
3
. When the signal comes from the next
process, it is carried out.
1
Transporting board in
• The board transported in from the previous process
is set in the board holder and the machine is ready
for printing.
2
Printing solder
• Solder is printed on board.
3
Transporting board out
• Board is transported out of the board holder to the
next process.
1B4C-039E
1B4C-041E
Previous
process Next
process
Conveyor (Left) Conveyor (Right)
1B4C-040E
Previous
process Next
process
Conveyor (Left) Conveyor (Right)
Mask
Board
Squeegee
Solder