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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are
integrated circuits and some field-effect transistorsand semiconductor"chip" components. The following
techniques should be used to help reduce the incidence of component damage caused by electro static
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available dischargingESDwrist strap, which should be removed
for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of
the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as
"anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage
ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you
are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted
together by conductive foam, aluminum foil or comparableconductivematerial).
7. Immediately before removing the protective material from the leads of a replacement ES device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
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