PAN301x Bluetooth Module
3 PAN301x Module
Module Integration Guide Rev. 1.0
Page 11 of 30
3.3 Placement
Antenna “Keep out Area”
Do not place any ground plane under the marked restricted antenna area in
any layer! This would be affecting the performance of the chip antenna in a
critical manner.
Impact of Placement on the Antenna Radiation Pattern
The placement of the module, surrounding material, and customer
components has an impact on the radiation pattern of the antenna.
The recommendation for the ground plane is based on a FR4 2-Layer PCB.
The following requirements must be met:
✓
Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
✓
Keep this product away from other high frequency circuits.
The antenna requires a cutout area
of 5 mm × 3 mm under the PAN301x modules. This “Keep
out A
rea” shall be located in every layer under the module antenna. Note for example the “Keep
out A
rea” in all layers of the PAN301x evaluation board.
Temperature- and Humidity Sensor (PAN3012)
Reduce the temperature influence from surround circuits.
I
t is recommended to cut the copper and/or use vent aperture in the area “Temp/Hum Sensor”.
Avoid materials that can absorb humidity in the dead volume.
Large dead volume will increase the humidity response time significantly.
It is recommended to minimize the volume and trying to shape a tailored housing around the
perimeter of the sensor.
3-axis Magnetometer (PAN3011/PAN3013)
Keep away any circuits or copper-lines with high currents from the magnetometer. It is
recommended to cut the copper as much as possible under the magnetometer area.
3D Accelerometer and 3D Gyroscope
Avoid bending of the mother-
PCB’s. Deformations can have a significantly affect to the
measurement results of the 3D accelerometer and 3D gyroscope.
