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11
3.3.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
q
C (86
q
F) more than that of the
normal solder.
Distinction of PCB Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
q
C
(662±86
q
F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
Содержание Lumix DMC-GH1KPP
Страница 15: ...15 4 Specifications...
Страница 34: ...34 7 Troubleshooting Guide...
Страница 35: ...35...
Страница 36: ...36...
Страница 37: ...37...
Страница 41: ...41 9 Disassembly and Assembly Instructions 9 1 Disassembly Flow Chart 9 2 PCB Location...
Страница 43: ...43 9 3 1 Removal of the Rear Case Unit Fig D1 Fig D2...
Страница 44: ...44 9 3 2 Removal of the Top Case Unit Fig D3 9 3 3 Removal of the LVF Unit Fig D4...
Страница 46: ...46 Fig D8 9 3 7 Removal of the Battery Case Unit Fig D9 9 3 8 Removal of the Speaker and DC Cover Fig D10...
Страница 47: ...47 Fig D11 9 3 9 Removal of the Flash P C B Fig D12 Fig D13 9 3 10 Removal of the Flash Sub P C B Unit Fig D14...
Страница 48: ...48 Fig D15 9 3 11 Removal of the AF Assist P C B EXT MIC P C B and Remote P C B Fig D16...
Страница 49: ...49 Fig D17 9 3 12 Removal of the Optical Sensor Unit Fig D18 9 3 13 Removal of the LCD Unit Fig D19...
Страница 50: ...50 Fig D20 9 3 14 Removal of the LCD TFT Unit Fig D21...
Страница 51: ...51 9 3 15 Removal of the Mic P C B and Mic Unit Fig D22 Fig D23...
Страница 54: ...54...
Страница 56: ...56 There are no LCD LVF adjustment model...