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*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
6.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
7. CPU DATA
9
Содержание KX-TS100EXW
Страница 2: ...1 LOCATION OF CONTROLS 2 CONNECTION 2...
Страница 5: ...3 2 Answering Calls 5...
Страница 6: ...4 SPECIAL FEATURES 6...
Страница 10: ...8 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 9 IC BLOCK DIAGRAM 10...
Страница 17: ...15 ACCESSORIES AND PACKING MATERIALS 17...