Panasonic KX-TG5431BXS, Руководство по обслуживанию

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14.5. Base Unit Reference Drawing 60
14.6. Handset Reference Drawing 61
14.7. Frequency Table 62
14.8. How to Clear User Setting 64
15 DESCRIPTION 65
15.1. Frequency 65
15.2. FHSS (Frequency Hopping Spread Spectrum) 65
15.3. Signal Flowchart in the Whole System 67
16 EXPLANATION OF LINK DATA COMMUNICATION 68
16.1. Calling 68
16.2. To Terminate Communication 68
16.3. Ringing 68
17 BLOCK DIAGRAM (BASE UNIT_MAIN) 69
18 CIRCUIT OPERATION (BASE UNIT_MAIN) 70
18.1. DSP (Digital Speech/Signal Processing: IC501) 70
18.2. Flash Memory (IC601) 70
18.3. Power Supply Circuit 71
18.4. Reset Circuit 73
18.5. Locator/Intercom Mode 74
18.6. Telephone Line Interface 74
18.7. Auto Disconnect Circuit 75
18.8. Parallel Connection Detect Circuit 76
18.9. Calling Line Identification (Caller ID) 77
19 BLOCK DIAGRAM (BASE UNIT_RF PART) 78
20 BLOCK DIAGRAM (HANDSET_RF PART) 79
21 CIRCUIT OPERATION (RF PART) 80
21.1. Power Supply Circuit 81
21.2. 2.4GHz Mod/Demod Circuit 82
21.3. 5.8GHz Converter Circuit 83
21.4. 5.8GHz LNA (Low Noise Amplifier) Circuit 84
21.5. 5.8GHz Power Amplifier and Antenna Switch Circuit 85
22 BLOCK DIAGRAM (HANDSET) 86
23 CIRCUIT OPERATION (HANDSET) 87
23.1. Construction 87
23.2. Power Supply Circuit 88
23.3. Charge Circuit 89
23.4. Ringer and Handset SP-Phone 89
23.5. Sending Signal 90
23.6. Reception Signal 90
24 SIGNAL ROUTE 91
25 CPU DATA (BASE UNIT) 93
25.1. IC501 93
26 CPU DATA (HANDSET) 94
26.1. IC201 94
27 EXPLANATION OF IC TERMINALS (RF PART) 95
27.1. IC701 95
27.2. IC801 96
27.3. IC851 97
28 HOW TO REPLACE THE FLAT PACKAGE IC 98
28.1. PREPARATION 98
28.2. FLAT PACKAGE IC REMOVAL PROCEDURE 98
28.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 99
28.4. BRIDGE MODIFICATION PROCEDURE 99
29 CABINET AND ELECTRICAL PARTS (BASE UNIT) 100
30 CABINET AND ELECTRICAL PARTS (HANDSET) 101
31 ACCESSORIES AND PACKING MATERIALS 102
31.1. KX-TG5431BXS 102
32 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
103
32.1. Base Unit 103
32.2. Handset 103
33 REPLACEMENT PARTS LIST 104
33.1. Base Unit 104
33.2. Handset 106
33.3. Accessories and Packing Materials 108
34 FORSCHEMATIC DIAGRAM 109
34.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
109
34.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN)) 109
35 SCHEMATIC DIAGRAM (BASE UNIT_MAIN) 110
36 SCHEMATIC DIAGRAM (BASE UNIT_RF PART) 112
37 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION) 114
38 SCHEMATIC DIAGRAM (HANDSET_MAIN) 116
39 SCHEMATIC DIAGRAM (HANDSET_RF PART) 118
40 CIRCUIT BOARD (BASE UNIT_MAIN) 121
40.1. Component View 121
40.2. Flow Solder Side View 122
41 CIRCUIT BOARD (BASE UNIT_OPERATION) 123
41.1. Component View 123
41.2. Flow Solder Side View 124
42 CIRCUIT BOARD (BASE UNIT_RF PART) 125
43 CIRCUIT BOARD (HANDSET_MAIN) 127
43.1. Component View 127
43.2. Flow Solder Side View 128
44 CIRCUIT BOARD (HANDSET_RF PART) 129
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KX-TG5431BXS / KX-TGA542BXS