25.1. IC1 (BBIC)
57
26 EEPROM LAYOUT (BASE UNIT)
59
26.1. Scope
59
26.2. Introduction
59
26.3. EEPROM Layout
59
27 EEPROM LAYOUT (HANDSET)
61
27.1. Scope
61
27.2. Introduction
61
27.3. EEPROM contents
61
28 HOW TO REPLACE FLAT PACKAGE IC
64
28.1. Preparation
64
28.2. Procedure
64
28.3. Modification Procedure of Bridge
64
29 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
65
30 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 66
31 ACCESSORIES AND PACKING MATERIALS
67
32 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
68
32.1. Base Unit
68
32.2. Handset
68
33 REPLACEMENT PARTS LIST
69
33.1. Base Unit
69
33.2. Handset
70
33.3. Accessories and Packing Materials
71
33.4. Fixtures and Tools
71
33.5. Memo
72
34 SCHEMATIC DIAGRAM (BASE UNIT)
73
35 SCHEMATIC DIAGRAM (HANDSET)
75
36 CIRCUIT BOARD (BASE UNIT)
77
36.1. Component View
77
36.2. FlowSolder Side View
78
37 CIRCUIT BOARD (HANDSET)
79
37.1. Component View
79
37.2. FlowSolder Side View
80
3
KX-TCD400RUB / KX-TCD400RUC / KX-TCD400RUF / KX-A140RUB / KX-A140RUC / KX-A140RUF