20.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on
carrier frequency.
Signal Pass:
*Refer to
SIGNAL ROUTE
().
20.4.1. Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC
(IC2) as shown in
BLOCK DIAGRAM (BASE UNIT)
()
The voice signal passes through the analog part of IC2 where it is amplified and converted to a
digital audio stream signal. The burst switch controller processes this stream performing
encryption and scrambling, adding the various other fields to produce the GAP (Generic Access
Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and
amplified, and radiated from antenna. Handset detects the voice signal or data signal in the
circuit same as the following explanation of Receiver Block.
20.4.2. Receiver Block
The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input
to IC3 as shown in
BLOCK DIAGRAM (BASE UNIT)
().
In IC3, the signal of 1.9 GHz band is demoduleted, and goes to IC2 as GAP (Generic Access P
rofile) standard DECT frames. It passes through the decoding section burst switch controller
where it separates out the frame information and performs de-encryption and de-scrambling as
required. It then goes to the DSP section where it is turned back into analog audio. This is
amplified by the analog front end, and goes to the TEL LINE Interface.
20.5. Pulse Dialing
During pulse dialing the hookswitch (Q2,Q3) is used to generate the pulses using the HOOK
control signal, which is set high during pulses. To force the line impedance low during the
"pause" intervals between dial pulses, the PULSE_DIAL signal turns on Q7.
21. BLOCK DIAGRAM (HANDSET)
22. CIRCUIT OPERATION (HANDSET)
22.1. Outline
53
Содержание KX-A143EXB
Страница 8: ...5 LOCATION OF CONTROLS 5 1 Base Unit 5 2 Handset 8 ...
Страница 18: ...8 OPERATIONS 8 1 Turning the Power On Off 18 ...
Страница 22: ...8 6 Selecting a Base Unit 9 DISASSEMBLY INSTRUCTIONS 9 1 Base Unit 22 ...
Страница 23: ...Shown in Fig To Remove Remove 1 Lower Cabinet Screws 2 6 12 A 2 2 Main P C Board Main P C Board 9 2 Handset 23 ...
Страница 26: ...11 TROUBLESHOOTING GUIDE Flow Chart 26 ...
Страница 49: ...18 FREQUENCY TABLE MHz 49 ...
Страница 56: ...25 CPU DATA BASE UNIT 25 1 IC2 BBIC 56 ...
Страница 60: ...45 MICP A I 60 ...
Страница 73: ...73 ...
Страница 74: ...31 CABINET AND ELECTRICAL PARTS LOCATION HANDSET 32 CABINET AND ELECTRICAL PARTS LOCATION CHARGER UNIT 74 ...
Страница 75: ...33 ACCESSORIES AND PACKING MATERIALS 75 ...
Страница 76: ...33 1 KX TCD430FXB FXC FXW 33 2 KX A143EXB EXC EXW 76 ...
Страница 77: ...34 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 34 1 Base Unit 77 ...
Страница 80: ...35 1 2 Main P C Board Parts Note 1 When replacing IC1 data need to be written to it with PQZZTCD430FX 80 ...
Страница 97: ...TP3 R2 27 TP4 D1 2 1 J1 pinL DC_PLUG 22 Charge_minus TP1 TP2 R1 Charge_plus SCHEMATIC DIAGRAM CHARGER UNIT ...
Страница 102: ...PbF D1 J1 CIRCUIT BOARD CHARGER UNIT Component View ...
Страница 103: ...PbF R1 R2 TP4 TP1 TP2 TP3 CIRCUIT BOARD CHARGER UNIT Flow Solder Side View ...
Страница 104: ...Marked PbF IC1 IC3 IC2 1 1 64 49 33 4 5 8 1 11 28 18 ...
Страница 106: ...PbF IC1 IC2 100 80 30 50 5 8 4 1 11 18 1 IC3 Marked ...
Страница 107: ...1 PROG PbF BOOK UP POWER CAN DOWN RIGHT REDIAL LEFT 1 2 3 6 5 7 0 R 4 9 8 INT MIC TALK 36 CN2 Marked ...
Страница 108: ...PbF D1 J1 Marked PbF R1 R2 TP4 TP1 TP2 TP3 Marked Component View Flow Solder Side View ...
Страница 112: ...PbF R1 R2 TP4 TP1 TP2 TP3 Digital Volt Meter 12Ω 2W A ...