Matters to Be Observed When Using This Product
■
When soldering the surge absorber, follow recommended soldering conditions shown in the following table so that
solder or the insulation material making up the surge absorber is not melted.
■
When making holes for mounting the surge absorber on the board, check the dimensions of the holes on the board,
referencing the central point of the interval between the leads.
Because the overall dimensional tolerance is large, forming the holes with high precision requires careful processing.
Note 1: Soldering the surge absorber under soldering conditions different from the recommended soldering
conditions requires extra checking to ensure it won’t cause any problems.
Additional soldering is allowed only once. It must be done within 5 seconds, with the soldering iron
temperature kept at 400
℃
or lower.
Note 2: A temperature profile may include a large error, depending on the measurement method used.
Be careful in such cases.
Note 3: Board temperatures vary depending on the sizes of boards and mounting densities. Confirm the
temperature for each type of board.
<Recommended soldering temperature profile>
* Do not perform reflow soldering more than two times.
■
Mounting the surge absorber (SMD-type)
When mounting the surge absorber on the board, make sure that no excessive impact or load, such as pressure from a
suction nozzle for mounting the absorber, positional shift, or mechanical impact/stress caused by a positioning of the
absorber, is applied to the surge absorber. There are cases where the surge absorber shifts from its intended position
when mounted on the board. In such cases, consider a method of bonding the board and the outer sheath resin together.
■
Do not keep the product in a high-temperature or high-humidity condition. Keep the surge absorber in a room with
a temperature of 40
℃
or lower and a relative humidity of 75% or lower and use the surge absorber within two years of
storage. Check the solderability of a surge absorber stored for a long period (two years or more) before using the surge
absorber.
■
Keep the surge absorber in a place where no corrosive gas atmosphere (hydrogen sulfide, sulfurous acid, chlorine,
ammonia, etc.) is present.
■
Keep the surge absorber in a place where the surge absorber is protected from direct sunlight, dew concentration, etc.
30-Jun-23
10 seconds or less
Normal temperature
to 130
℃
260
℃
or less
Normal temperature to
preheating temperature
30 to 60 seconds
150
℃
to 180
℃
200
℃
to 100
℃
1 to 4
℃
per second
Preheating temperature to 200
℃
60 to 120 seconds
Preheating part
Soldering part
2 to 6
℃
per second
Refer to the heat resistance range of the product
in the reflow soldering process.
Soldering method
Recommended conditions
Mater to note
Mounting and storage conditions
Main heating
part
Cooling part
A high component mounting density may lead to poor
solderability. In such a case, consider vent hole formation.
When a land is excessively larger than the terminal surface of
a component, the component may shift position when solder is
melted.
D-type
260
℃
, 10 seconds or less The D-type surge absorber should not be soldered by reflow
soldering.
SMD-type
Flow soldering
(solder bath immersion method)
Flow soldering
(solder bath immersion method)
Reflow soldering
(controlled atmosphere heating
method)
260
℃
, 10 seconds or less
Refer to the recommended
soldering temperature
profile.
Cooling part
Gradual cooling
(cooling under the normal temperature)
120 seconds or less
Temperature-rising
part I
Preheating part
Temperature-rising
part II
Cooling part
Temperature-rising part (II)
Temperature-rising part (I)
Preheating part
Main heating part
Cooling part
Time
Preheating part
Soldering part
Reflow soldering
(controlled atmosphere heating method)
Heat resistance range of the
product in the reflow soldering
process
Time
Tem
per
at
ur
e (
°
C)
200
220
210
260
250
0
20
60
240
230
10
30
40 50
Time (s)
Tem
per
at
ur
e (
°
C)
Ter
m
inal
tem
per
at
ur
e (
°
C)
Flow soldering
(solder bath immersion method)
