5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Содержание HDC-HS700EB
Страница 11: ...11 3 5 2 Precautions for installing HDD ...
Страница 14: ...14 3 6 Formatting ...
Страница 15: ...15 4 Specifications ...
Страница 16: ...16 ...
Страница 17: ...17 ...
Страница 30: ...30 Fig D2 8 3 2 Removal of the HDD Fig D3 ...
Страница 31: ...31 8 3 3 Removal of the HDD Gnd Case Unit Fig D4 8 3 4 Removal of the Top Case Unit Fig D5 Fig D6 ...
Страница 32: ...32 8 3 5 Removal of the Front Unit Fig D7 8 3 6 Removal of the Side Case R Unit Fig D8 ...
Страница 35: ...35 Fig D16 8 3 12 Removal of the Fan Motor Fig D17 8 3 13 Removal of the LCD Case Unit Fig D18 ...
Страница 36: ...36 8 3 14 Removal of the Monitor P C B Unit Fig D19 Fig D20 ...
Страница 37: ...37 Fig D21 8 3 15 Removal of the Front P C B Unit Fig D22 8 3 16 Removal of the Barrier Motor Unit Fig D23 ...
Страница 38: ...38 Fig D24 8 3 17 Removal of the Front Case Fig D25 Fig D26 ...
Страница 39: ...39 8 3 18 Removal of the MF SENS P C B Unit Front Case Unit MF Front Frame and MF Sheet Fig D27 Fig D28 ...
Страница 43: ...43 8 3 28 Removal of the IRIS Unit Fig D40 8 3 29 Removal of the Zoom Motor Fig D41 ...
Страница 46: ...46 8 3 35 Removal of the Focus Guide Pole L and Focus Guide Pole S Fig D48 ...
Страница 85: ...S7 3 EVF Section S 35 B23 59 B22 58 60 61 62 63 65 64 66 67 68 69 70 72 71 73 74 75 76 77 B24 ...
Страница 86: ...S7 4 LCD Section S 36 27 28 29 26 30 32 23 31 25 22 B7 B8 24 ...