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Matters to Be Observed When Using This Product

 This product (fixed resistor) is not designed for use in specific environments. Using the resistor in the following specific

environments or service conditions may affect the performance/reliability of the resistor. Avoid using it in such specific 

environments. If you intend to use the resistor in such environments, checking the performance, reliability, etc., of the 

product sufficiently is your own responsibility.
(1) Used in liquid, such as water, oil, chemicals, and organic solvents.

(2) Used in a place exposed to direct sunlight, an outdoor place with no shielding, or a dusty place.

(3) Used in a place where the product is heavily exposed to sea breeze or a corrosive gas, such as Cl

2

, H

2

S, NH

3

, SO

2

,

or NO

X

.

(4) Used in an environment where static electricity and electromagnetic waves are strong.

(5) Located close to a heating component or a flammable material, such as a vinyl cable placed near the product.

(6) Sealed or coated with a resin.
(7) Solder flux of the resistor soldered with no-clean type solder, etc., is cleansed with a solvent, water, or a water-soluble 

cleaner, etc. (Water-soluble flux residues have a particularly large influence on a resistor.)

(8) Used in a place where dew concentrates on the product.

(9) Used in a contaminated state.

(Example: Touching the resistor mounted on a printed board leaving sebum on the resistor (improper handling))

 Sealing the resistor with a resin in a resin potting process, damp-proofing process, etc., applies excessive stress to the

resistor, which may cause the internal electrodes a connection problem. In such cases, the proper operation of the 

resistor is not guaranteed. If you intend to use the resistor in such environments, checking the performance, reliability, etc., 

of the product sufficiently is your own responsibility.

 Do not leave the resistor immersed in a solvent for a long time. When using the resistor immersed in a solvent, confirm

the operation of the product mounted on the board.

 When a cleaning solution or cleaning condition for cleaning the printed board or a drying condition for drying the printed

board after soldering the resistor is improper, it may have a negative effect on the performance/reliability of the resistor. 

Confirming these conditions sufficiently is your own responsibility. Also examine the effects of soiled cleaning agent, 

cleaning residues, and post-cleaning contaminations, and control for these effects properly.

 When the resistor is heating abnormally or emitting a smell, stop using the resistor immediately, for example, turn off

the main power supply of the device.

Also, keep your face and hands away from the product as it may become hot and cause burns.

 The resistor is so thin that it may break easily when subjected to impact. Before putting the resistor in use, confirm that

the resistor has not been broken by impact that applied thereto when mounted on the printed board. Applying impact to 

the resistor or pinching the resistor with a hard tool (pliers, tweezers, etc.) may chip the resistor or its protective film, 

which affects its performance. Be careful to avoid such cases.

 Do not reuse a resistor having been used on a printed board and removed therefrom. Do not touch the resistor with your

bare hands.

 Be careful not to drop the resistor on the floor, etc. The resistor is likely to suffer mechanical or electrical damage when

dropped on the floor. Avoid using said resistor.

 The resistor may have its resistance value changed due to electrostatic discharge (ESD). Take ESD prevention measures

when handling the resistor. ESD prevention measures include an environment where static electricity is not likely to be 

generated (recommended RH: 40% to 60%), by wearing an earth band, conductive gloves, etc., grounding the device in 

which the resistor is incorporated, and placing a conductive mat, etc., on a work platform.

 Select a rated current for the chip fuse so that a current flowing through the chip fuse, in a normal condition, is 70% or less

of the rated current. Do not let a current larger than the rated current flow continuously through the chip fuse.

30-Jun-23

Matters to Be Observed When Using This Product

(Rectangular chip fuse)

 

Use environments and cleaning conditions

 

Response to anomalies and handling conditions

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Содержание ERB RD Series

Страница 1: ...e each subject to change without notice Ask factory for the current technical specifications before purchase and or use E G 0603 inch size 1206 inch size 1 25A X Pressed carrier taping 2 mm pitch 10 0...

Страница 2: ...R25 0 63 125 82 220 190 32 35 40 to 125 3 15 1 4 4 0 1 5 2 0 2 5 2 0 2 5 3 0 4 0 1R50 33 1 0 1 5 0 5 N F 0R50 1 0 0 5 Rated current 200 5 seconds max 50 40 to 125 Rated voltage Open circuit voltage V...

Страница 3: ...current 1000 h 70 Load 70 rated current 1000 h 60 90 to 95 RH 1000 h no load 40 30 min 125 30 min 5 cycles 260 5 10 s 25 Test Item Performance requirements Within specified tolerance 10 10 0402 inch 1...

Страница 4: ...er and printed circuit board for solderability before actual use 2 00 60 s to 120 s 8 00 1 90 1 75 0 10 0 07 ERBRG ERBRE Quantity 10 000 pcs reel 5 000 pcs reel W1 W2 A 1 0 0 13 0 0 2 N C Part no A B...

Страница 5: ...UN numbers UN classifications etc does not apply to this product In addition when exporting products product specifications and technical information described in this catalog please comply with the l...

Страница 6: ...printed board or a drying condition for drying the printed board after soldering the resistor is improper it may have a negative effect on the performance reliability of the resistor Confirming these...

Страница 7: ...incorporated in your product is equal to or lower than the specified temperature and then use the resistor Continuously using the chip fuse in a fused state is not allowed When the chip fuse fuses off...

Страница 8: ...may affect the quality of the resistor Do not use such solder Use rosin based solder flux When using highly active solder flux made mainly of halogen chlorine bromine etc flux residues may affect the...

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