Micro Chip Fuse
●
Standard quantity
●
Carrier taping
●
Taping reel
Unit : mm
Unit : mm
Recommendations and precautions are described below
●
Recommended soldering conditions for reflow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example :Sn/Ag/Cu)
●
Recommended soldering conditions for flow
《
Repair with hand soldering
》
●
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less.
Solder each electrode for 3 seconds or less.
●
Never touch this product with the tip of a soldering iron.
Part no.
+0.10
0
±0.10
0.68
ERBRD
ERBRE
ERBRG
20 s to 30 s
max. 260
℃
max. 10 s
For soldering
For lead-free soldering
max. 10 s
60 s to 120 s
Time
150
℃
to 180
℃
9.0
+1.0
0
11.4
±1.0
0
-1.5
180.0
60
・
Reflow soldering shall be performed a maximum of two times.
・
Please contact us for additional information when used in
conditions other than those specified.
・
Please measure the temperature of the terminals and study
every kind of solder and printed circuit board for solderability
before actual use.
2.00
60 s to 120 s
8.00
1.90
1.75
±0.10
±0.07
ERBRG
ERBRE
Quantity
10,000 pcs / reel
5,000 pcs / reel
W
1
W
2
øA
+1.0
0
13.0
±0.2
øN
øC
Part no.
A
B
W
F
E
235 ± 5
℃
max. 10 s
Preheating
Main heating
Peak
Recommended soldering conditions
ERBRG
ERBRE
2.00
1.10
±0.05
1.20
±0.10
ERBRD
1.50
±0.10
2.00
±0.10
±0.05
4.00
±015
3.60
±020
Above 200
℃
30 s to 40 s
Part no.
P
1
P
2
P
0
øD
0
T
0.67
0.78
0.84
Temperature
Time
140
℃
to 160
℃
2020/3/1
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Time
Temperature
Time
max. 260
℃
Temperature
60 s to 120 s
150
℃
to 180
℃
Preheating
Soldering
Temperature
140
℃
to 160
℃
245±5
℃
Main heating
Peak
60 s to 120 s
Above 230
℃
30 s to 40 s
Preheating
Packaging methods (Taping)
ERBRD
4.00
±0.10
Pitch (P
1
)
2 mm
4 mm
Part No.
Size (inch)
ERBRD
ERBRE
ERBRG
0402
0603
1206
Kind of Taping
Pressed Carrier Taping
Punched Carrier Taping
±0.10
±0.10
±0.20
3.50
±0.07
±0.07
Pressed
T
P
2
P
0
T
A
P
1
P
1
(2
ｍｍ
pitch)
F
W
E
B
Punched
carrier
Peak
Preheating
Heating
Time
Tem
per
at
ur
e
øC
W
1
øN
øA
W
2
øD
0
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